Collaborative cleaning process innovations from managing experience and learning curves
Collaborative cleaning
process innovations from
managing experience and
learning curves
Mike Bixenman, DBA and Dirk Ellis, Kyzen Corporation, Nashville, TN and John Neiderman,
Speedline Technologies, Camdenton, MO
introduction
board manufacturers hinges on density
The trend toward highly dense
The pace of surface mount technology
and miniaturization.
1
High performance
assemblies reduces the spacing
development and innovation is a
electronic assembly designs will be driven
between conductors while
response to market pressures for higher
by multi-chip density, increasing number
yielding a larger electronic
functionality, cost reduction, cycle time
of I/Os, decreased area array pitches and
field. As the industry moves
reduction and improved quality.
1
To
tighter component standoff heights.
achieve increased functionality, today’s
to higher functionality,
circuit assemblies pack more performance
miniaturization and lead-free
problem statement
into smaller board designs. Advanced
IPC TechNet Blog addresses the
soldering, studies show that
package designs require an increasing
question of no-clean relevance and the
cleanliness of the assembly
number of interconnects to support power
hidden factors involved with successful
becomes more important. requirements and bandwidth. With active
implementation of no-clean assembly
Residues under low standoff and passive component size reduction, area processes.
2
The social network authors
components, with gaps less
array pitch and standoff off height also
noted that no-clean soldering technology
than 2 mils, represent an
reduce, which increases cleaning difficulty.
was developed when circuit designs had
increasingly difficult cleaning
Technology-based market pressures
increased spacing from component leads
challenge. Collaboration
increase reliability demands as electronic
and terminations. With increased board
from cleaning equipment and
assemblers move upstream from
density and miniaturization, no-clean
conventional designs and toward threshold
cleaning material companies
flux technology may no longer be a viable
and leading edge technologies. Over the
has led to innovations
technology alternative to support leading
past two decades, conventional surface
edge technologies. To quantify risk of
for improving throughput
mount technologies successfully adopted
no-clean soldering, process and design
and complete residue
low residue no-clean soldering practices.
engineers are supplementing bulk ion
removal under low standoff Today’s challenge for printed circuit
extraction and electrical studies with site-
components. The purpose of
this paper is to report both
mechanical and chemical
innovations that open the
process window.
Keywords: Cleaning Challenges,
Cleaning Innovations, Process
Optimization, Mechanical
Cleaning, Cleaning Chemistries
 
 
Figure 1. Electrochemical migration failure ranges.
24 – Global SMT & Packaging – October 2009 www.globalsmt.net
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