New Products
of stencil technology and related tool-
New Switch-a-pitch adapters
proprietary technology that prevents pump-
ing to accommodate various production
provide even smaller pitch landing
out.
www.intelligentgrease.com
demands; and 3) providing comprehensive
pads for use on larger pitch boards
process management to ensure quality, on-
Aries Electronics has expanded its line of
ecD introduces Map software ver-
time delivery, and product uniformity on
BGA Switch-A-Pitch adapters that simplify
sion 2.17c with additional thermal
a global basis. The three-pronged approach
high density interconnect (HDI) construc-
profiling benefits
starts with a comprehensive product offer-
tion to enable the use of smaller pitch
ECD’s most recent upgrade to its MAP®
ing of stencils, screens, blades and related
devices on larger pitch boards. The series
(Machine, Assembly, Process) software
tooling. The design aspect provides CAD
now includes models with tops where
incorporates suggestions from Celes-
services, including design review and check
the BGA landing pads are on a 0.40 mm
tica, Intel, Accu-Rite and Silicon Forest
plots, design library standardization and
pitch and adapter bottoms are populated
Electronics, reflecting real-world improve-
management and weekly reporting. iPASS
with BGA balls on a 1.27 mm pitch. The
ments, not just upgrades for the sake of
process management includes training,
new adapters significantly reduce costs
announcing something new. New features
managed product rollout, order confir-
because designers can use readily available,
include a cropping tool to easily remove
mation and on-time delivery, and data
and therefore less expensive, larger pitch
extraneous data, profile data extraction for
reporting, all integrated within an ISO
boards. In addition, manufacturers can
Cooling Slopes After Peak, batch down-
9001:2000 framework.
www.photostencil.com
add components to designs at much lower
load of multiple runs stored on ECD’s
costs, since the adapter tops leave open
MEGAM.O.L.E.®20 and V-M.O.L.E.®,
space around the location for the replace-
date-time auto file naming option, and
ment device.
www.arieselec.com
one-click direct-to-Excel data exporting in
user-specified units.
Customers can download MAP®
V2.17c by visiting
www.ecd.com/
downloads. Online training for MAP®
V2.17c software, as well as for other ECD
products, is available online at no charge
through ECD-U. To find a convenient
class, consult the schedule at
www.ecd.com/
ecd-u.
Mill-Max adds gull wing SMT .070”
New silicon encapsulent for over-
pitch ShrinkDip & Sip sockets and
lorD corporation develops
molding process from Dow corning
headers
thermally conductive no pump-out
electronics
Mill-Max series 117, 127, 217 & 227
grease
Dow Corning Corporation’s Electronics
shrinkDIP sockets accommodate memory
LORD Corporation’s TC-501 grease—“the
group introduced its newest silicone encap-
chips and components that have pin-to-pin
Intelligent Grease”—is a no pump-out mate-
sulant, Dow Corning ®OE-6636, designed
spacing of .070” (1.778mm). The reduced
rial that replaces greases used as thermal
for overmolding (compression molding)
pattern of the shrinkDIP series also saves
interface materials (TIM) between the
and dispensing processes. The product
valuable board space for board-to-board
heat spreader and the heat sink (com-
provides for a high refractive index (RI) of
connections as more pin connections
monly known as TIM2). TC-501 Grease,
1.54 which enables better light output, has
can be made using less “real estate” than
a silicone TIM, provides high thermal
a low moisture uptake, improves thermal
standard .100” pitch patterns. They can
conductivity and low thermal resistance
aging and light resistance and possesses
also be mated with series 162 shrinkDIP
for applications in which superior heat dis-
better adhesion to typical substrate for
headers for board-to-board connections.
sipation is required. Unlike commercially
LED packages such as Poly Phthal Amid.
www.mill-max.com
available greases that eventually pump out,
Overmolding, a new trend in LED packag-
LORD TC-501 grease was developed using
ing, enables higher throughput than a typi-
cal dispensing process, making hundreds
high-lead and lead-free capable multicore die attach solder paste
of LED packages at a time. www.dowcorning.
Henkel has launched a new high-lead and lead-free capable die attach solder paste
com/led
for enhanced thermal control of power devices under their leading Multicore®
brand of solder materials. Multicore® DA100 incorporates a no clean, ROLO flux
eV group unveils next-generation
system that can be used for high-lead applications and uniquely offers capability for
uV-Nanoimprint lithography step
and repeat system
lead-free processes as well. Using specific high temperature Pb-free alloys to offer the
EV Group (EVG) unveiled its next-gener-
same thermal control necessary for today’s rectifiers, power transistors, amplifiers
ation UV-nanoimprint lithography (UV-
and many other consumer and automotive components, Multicore DA100 effectively
NIL) step and repeat system, the EVG770
complies with the environmental goal of lead elimination in power packages by 2013,
Gen II NIL Stepper. The new system
as stipulated by ROHS legislation. Furthermore, packaging specialists that wish to use
features capabilities designed to address
high-lead solders today, can easily move to lead-free solders tomorrow, while utilizing
growing customer demands for improved
the same flux system offered through Multicore® DA100. This ability to employ a
pattern fidelity at ever-smaller feature
consistent flux system is extremely beneficial to customers, as it minimizes the impact
densities, greater process reliability and in-
of flux reliability evaluation programs for such critical elements as cleanability, wire
creased accuracy. The EVG770 eliminates
bonding and molding, among others.
www.henkel.com/electronics
defect issues caused by trapped air bubbles
44 – Global SMT & Packaging – September 2009
www.globalsmt.net
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