New Products
aqueous Technologies announces three-year
warranty
Aqueous Technologies Corp. increased its standard
warranty on its award-winning Trident series defluxing
systems from one year to three. “The Trident Series
automatic defluxing and cleanliness testing systems
represent best-in-class defluxing technology,” said
president and CEO Michael Konrad. “Now, it is time
to demonstrate our confidence in Trident with the
defluxing industry’s first and only standard three-year
warranty.” www.aqueoustech.com
imide, glass, and ITO-sputtered surfaces.
The printed void-free coating is resistant
to humidity, temperature fluctuations and
solvents. This product is designed for use
with a variety of CMI conductive silver and
carbon inks. www.creativematerials.com
microelectronic assemblies. The fast cure
minimizes processing and energy costs as-
sociated with alternative technologies that
can only say if the nozzle is functioning
require mixing or elevated temperatures
correctly during a test cycle. They can’t tell
for curing. The materials are all one part,
you anything about the function of the
so no mixing is required and viscosity is
drop jet nozzle during the actual produc-
consistent. Various viscosities are available
tion process, nor can they monitor the
to provide optimal coverage over various
quantity of flux being applied to the board.
geometries. Multi-Cure 9001-E Series
SEHO Systems GmbH has developed a
encapsulants display excellent adhesion to
real-time, real-quantity drop jet fluxer that
Polyimide, PET, flexible printed circuits,
not only monitors the function of the drop
FR4 and ceramic boards, and provide
jet nozzle during actual product but also integrated MeMS test cells provide
superior protection for glob top and chip-
measures the actual flux quantity jetting high-throughput full final test
on-board applications. They are ideal for
by the nozzle during the fluxing process. SPEA has developed automated test cells
encapsulating ICs in flex circuits.
The measured quantity is compared with specific to MEMS devices. The test cells
www.dymax.com
a reference value, and when a deviation integrate all the elements for handling,
is detected, the system initiates an error contacting and complete testing, including
cookson electronics’ launches
message. The software also clearly indicates physical stimulus for functional test and
alpha® cVp-520 lead-free low
which part of the printed circuit board has tri-temp thermal conditioning. The test cell
temperature solder paste
not been fluxed correctly. www.seho.de is entirely designed an manufactured by
New Alpha® CVP-520 from Cookson
SPEA, for an integrated rather than hybrid
Electronics is a lead-free, no-clean, zero-
125-17—screen-printable solvent- solution, and is therefore able to perform
halogen solder paste designed for pin-in-
resistant flexible ultraviolet-curable all the operations for the test and handling
through-hole assembly of temperature-sen-
coating of MEMS devices, including the latest
sitive components. For mixed technology
Creative Materials’125-17, screen-printable generation of components that integrate
applications, CVP-520 could enable elec-
solvent-resistant flexible ultraviolet-curable multiple sensor functions on a single chip.
tronic assemblers to reduce or eliminate
coating, is a sky blue dielectric that is used www.spea.com
wave or selective soldering processes. Mitch
as a protective
Holtzer, global product manager, has
insulating layer as photo Stencil introduces ipaSS™
pointed out that beta site customers have
well as a crossover system
also discovered how much energy can be
layer for polymer Industry data shows that 84% of SMT
saved in a traditional SMT by using the
thick-film conduc- defects originate in the print process, and
new low-melting-point alloy. CVP-520 can
tive inks in printed 62% of those defects can be traced to the
be successfully reflowed at 155˚-190˚C
circuit applica- stencil. In order to reduce this critical
peak temperatures. www.alpha.
tions. This coat- defect rate, Photo Stencil has developed
cooksonelectronics.com.
ing is compatible the iPASS System with the specific goals of
with a range of 1) providing up-front design for manu-
Maximum process control for Seho
substrates, includ- facturability support; 2) offering a broad
selective soldering systems
ing polycarbonate, spectrum
Existing control systems for drop jet fluxers
polyester, poly-
www.globalsmt.net Global SMT & Packaging – September 2009 – 43
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