TitleNew Products
New products
ing of adhesive. It is able to meter small
Seika Machinery features yJ link
dots faster and more accurately than other
conveyor systems
systems because it “shoots” the dots instead
Seika Machinery, Inc., now features Young
of “pulling them off,” which is common for
Jin Conveyors for SPI and AOI. YJ Link’s
needle dispensing. The higher accuracy of
SPI NG/Good Buffer is designed to stack
the dots enables the placement of smaller
NG PCBs and transfer good PCBs to the
components such as 0603 chips or below.
next process using FIFO. This method pro-
The second dispenser can be an Archime-
vides increased line efficiency and requires
dean screw type, a time/pressure system
only minimal space for equipment. Using
with a Piezoflow valve or a second jet valve.
the SPI NG/Good Buffer, there is no need
The assembly head features optical center-
to filter NG PCBs and SPI operates nor-
ing. Production of double-sided flex boards
erSa ir/pl 650 Xl big board rework
mally, even during NG PCB verification.
is also possible.
www.essemtec.com
machine
YJ Link’s AOI NG Buffer stacks NG PCBs
For today’s rework operators working on
and pushes good PCBs to the next AOI
large PCBs, one truth remains constant—
inspection process.
rework difficulty increases with the size of
www.seikausa.com.
the PCB. ERSA’s new IR/PL 650 XL is
their flagship rework system for extra large
essemtec’s FlX2011-Mk places
PCBs. Boards up to 20” x 24” or 500 mm x
smaller components on flexible
625 mm can be safely and rapidly reworked
circuits
using one of the industry’s largest and most
The FLX2011-MK, Essemtec’s produc-
powerful bottom side heaters—an 8,000 W
tion center assembles complete flexible
medium wavelength IR heater measuring
circuits. The machine
500 mm x 625 mm. These extra powerful
dispense glue, solder
bottom & top heaters are necessary for
paste or conductive
large boards, especially for those which
adhesives, and it plac- Manncorp introduces under $25,000
are thicker than 3 mm. Unless the entire
es SMT components, high-mix placer; processes 0402s,
board area is efficiently preheated from the
LEDs and snap
QFps & Bgas
bottom, such boards show the tendency of
discs, all within one
Manncorp now offers a pick-and-place
bending and warping during the rework
minute. One of the
machine with a broad range of capabilities
procedure. The PCB table exposes the en-
two dispensers on
and extraordinary versatility at reportedly
tire PCB to the heater area—no cold spots
the FLX2011-MK is
breakthrough pricing. The new 7722FV
mean less warping. The IR/PL 650 XL
a jet valve dispensing
will mount most of today’s fine-pitch com-
system also features a highly efficient com-
system that features
ponents with ±0.1 mm placement accuracy
pressed air cooling system.
www.ersa.com
contactless meter-
for chips, including 0402s. Accuracy for
mounting SOICs, QFPs and BGAs to 40
mm square with 15-mil pitch is ±0.05 mm.
7722FV has a generous 56-feeder capacity
and a 6,000 dots-per-hour dispense option.
7722FV meets prototyping and low-volume
demands and is said to be particularly
suitable for OEMs bringing PCB assembly
in-house. In higher-volume assemblies, it
can also be used whenever modifications
are required within the same board run.
The 7722FV is under $25,000 with an in-
kic debuts next generation wave surfer measurement system
troductory offer of a $2,945 feeder package
KIC releases the second generation Wave Surfer, an easy-to-use, self-contained measure-
included at no added cost.
ment system for wave solder machines that provides critical data on wave solder machine
www.manncorp.com
setup and its process. As a wave solder machine profile fixture, Wave Surfer has five
embedded thermocouples and works in conjunction with your KIC profiler for quick and
resilient chip encapsulants provide
easy profiling and wave solder machine setup. Made of a material similar to typical wave
superior protection
solder pallets, the Wave Surfer can withstand thousands of passes. The fixture holds the
DYMAX Multi-Cure® 9001-E Series encap-
profiler in place during each run to measure the pertinent process data in the wave solder
sulants cure in seconds to provide superior
machine including peak temperature, dwell time, parallelism, and conveyor speed. www.
moisture and abrasion resistance and ther-
kicthermal.com
mal cycle performance of electronic and
42 – Global SMT & Packaging – September 2009
www.globalsmt.net
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