IC packaging technology retrospective—part 6
found some interest from some product
developers for broader market applications
It is a relatively expensive process, however,
and as a result has had difficulty finding
greater use. An example can be seen in
Figure 3.
In summary, while the use of the
third dimension is not all that new, it
is nevertheless compelling for many !
solid reasons, and it will likely see much
expanded use in the future. In the next ! !
part of this series, the matter of through
silicon via (TSV) technology will be
Figure 2 Top, side and bottom views of an extreme example of package stacking. (Courtesy Tessera)
explored.

Verdant Electronics founder and president
Joseph (Joe) Fjelstad has more than 35 years
of international experience in electronic
interconnection and packaging technology in
a variety of capacities from chemist to process
engineer and from international consultant
to CEO. Mr. Fjelstad is also a well known
!
author writing on the subject of electronic
Figure 3 Folded structures allow for testing before stacking to assure better yield while providing flexibility to com-
interconnection technologies. Prior to founding
bine die with differing wafer-level yield rates. Above is shown a process sequence for creating such an assembly.
Verdant, Mr. Fjelstad co-founded SiliconPipe (Courtesy Tessera)
a leader in the development of high speed
interconnection technologies. He was also
appointed to the first corporate fellowship for his
formerly with Tessera Technologies, a global
innovations.
leader in chip-scale packaging, where he was
International Diary
International Diary
3 – 5 June 2009 8 – 11 September 2009 4 – 8 October 2009
JPCA/PROTEC electronica India SMTA International
Tokyo, Japan Bangalore, India San Diego, CA, USA
jpcashow.com electronica-india.com smta.org/smtai
15 – 18 June 2009 14 – 18 September 2009 6 – 8 October 2009
EMPC 2009 PCB West Semicon Europe
Rimini, Italy Santa Clara, CA, USA Dresden, Germany
empc2009.org pcbwest.com semiconeuropa.semi.org
16 – 18 June 2009 23 – 24 September 2009
National Electronics Week IPC Midwest
London, UK Schaumburg, IL, USA
nationalelectronicsweek.co.uk ipcmidwestshow.org
14 – 16 July 2009 30 September – 1 October 2009
SEMICON West Electronics Technology ‘09 20 – 22 October 2009
San Francisco, CA, USA Coventry, UK Mexitronica
semiconwest.org www.electronicstechnology.co.uk Guadalajara, Mexico
mexitronica.com
46 – Global SMT & Packaging – August 2009 www.globalsmt.net
Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52