Solder joint reliability: acceleration transforms and acceleration factors Solder joint reliability: acceleration transforms and acceleration factors
t = half-cycle dwell time in
references:
December 2008, pp. 46-48.
D
minutes, and
1. Engelmaier, W., “How to Estimate
9. Engelmaier, W., “Solder Joint
c
Solder Joint Reliability, Part 1,” Global
0
, c
1
, c
2
and t
0
= coefficients specific to a Reliability Prediction for Chip
given solder alloy.
SMT & Packaging, Vol. 7, No. 9,
Components, MELFs, TSOPs, SOTs,
September 2007, pp. 60-64.
etc.,” Global SMT & Packaging, Vol. 9,
The coefficients and parameters specific to
2. Engelmaier, W., “How to Estimate
No. 7, June 2009, pp. 30-32.
a given solder alloy are given in Table 1.
Solder Joint Reliability, Part 2,” Global
With this information, Equation 1
SMT & Packaging, Vol. 7, No. 10,
Werner Engelmaier will be giving some
can be set up for both the accelerated
October 2007, pp. 64-66.
of his solder joint reliability workshops at
test conditions and the field-operating
3. Engelmaier, W., “Wear-Out System
IPC Midwest Conference in Schaumburg,
environment. Rearranging and simplifying
Reliability with Multiple Components
IL, September 23-25, 2009; there is also
results in the acceleration transform,
and Load Levels,” Global SMT &
the possibility, given sufficient interest, for
as seen in Equation 6, where all the
Packaging, Vol. 8, No. 7, July 2008, pp.
workshops in Madrid, Spain on November
parameters have been previously defined.
30-39.
18 and/or 19, 2009. For details of the
As can be seen from Equation 6, it is
4. Engelmaier, W., “Reliability of Lead-
workshops go to www.engelmaier.com; for more
not possible to reduce the acceleration
Free (LF) Solder Joints,” Global SMT
information about the workshops contact
transform to some ratio of the ΔT’s to
& Packaging, Vol. 3, No. 3, April
engelmaier@aol.com and for the IPC
some exponent as is often done—the
2003, pp. 36-38.
conferences
www.ipc.org.
exponents are different for the test and
5. Engelmaier, W., “Reliability of Lead-
field conditions.
Free (LF) Solder Joints Revisited,”
Werner Engelmaier has over 43 years experience
However, it is possible to get the
Global SMT & Packaging, Vol. 3, No.
in electronic packaging and interconnection
damage terms, ΔD, in ratio form as shown
7, October 2003, pp. 26-27.
technology. Known as ‘Mr. Reliability’ in the
in Equation 7; it is just not possible to do
6. Engelmaier, W., “Achieving Solder
industry, he is the president of Engelmaier
that explicitly in terms of AF.
Joint Reliability in A Lead-Free World,
Associates, L.C., a firm providing consulting
AF is then obtained by taking the ratio
Part 1,” Global SMT & Packaging, Vol.
services on reliability, manufacturing and
of the mean cycle numbers.
3, No. 6, June 2007, pp. 40-42.
processing aspects of electronic packaging and
7. Engelmaier, W., “Achieving Solder
interconnection technology. He is the chairman of
Joint Reliability in a Lead-Free World,
the IPC Main Committee on Product Reliability.
Part 2,” Global SMT
The TGM-ExnerMedal was bestowed on him
& Packaging, Vol. 7,
in 2009 in Vienna, Austria, he was elected
No. 8, August 2007,
into the IPC Hall of Fame 2003, and was
pp. 44-46.
awarded the IPC President’s Award in 1996
8. Engelmaier,
and the IEPS Electronic Packaging Achievement
Equation 6
W., “Creep-
Award in 1987. He also was named a Bell
Fatigue model for
Telephone Laboratories Distinguished Member
SAC405/305 Solder
of Technical Staff in 1986 and an IMAPS
Joint Reliability
Fellow in 1996. More information is available at
Estimation—A
www.engelmaier.com, and he can be reached at
Proposal,” Global
engelmaier@aol.com.
Equation 7
SMT & Packaging,
Vol. 8, No. 12,
New products, continued from page 41
are equipped with a specific interface to an 30 days. Qualitek analyzes the sample sent,
exchangeable adaptor giving fast changes then e-mail customers the status of solder
to accommodate different units under test impurities as well as the level of tin that
(UUT). Designed as a Commercial Off The will aid in identifying any solder joints or
Shelf (COTS) product, the desktop systems processing problems. To best suit customer
are available in the versions JULIET™-Base requirements, there are solder check-up
and JULIET™-Standard, with differences programs for leaded pots as well as lead
in the number of available I/O channels free.
www.qualitek.com
(120/240) and TAPs (2/4), as well as in the
scan performance (16MHz/50MHz).
universal boundary scan tester inte-
www.goepel.com
grates test electronics into fixture
GOEPEL electronic recently introduced
improved solder check up program
the development of JULIET™ (JTAG
Qualitek International expanded its Solder
UnLimItEd Tester), a family of completely
Check UP Program to include analysis for
integrated stand-alone production testers.
Sn100C, SACX, K100LD and Sn100E, in
The modular systems combine all test elec-
addition to the wide variety of pot alloys
tronics, as well as the basic mechanics in a
analysis already available. A solder analysis
compact desktop system. Furthermore, they
on a 1/2 lbs sample is recommended every
www.globalsmt.net Global SMT & Packaging – August 2009 – 43
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