New Products
protection and process management, the most aggressive decode algorithms featuring the same look, fit and function
marks a significant milestone in the release available, including symbol reconstruction. as a recently discontinued industry
history of BPM Microsystems’ software The QX-870’s intelligent sweeping laser standard syringe, with a substantial cost
platform. Some of the new and recent can reliably read multiple 1D and stacked savings. Techcon’s 700 Series is a drop-in
enhancements to BPWin 5.0 include 2D barcodes, in varying locations, even replacement solution to preserve process
intellectual property protection features, when small, poorly printed, or damaged. and improve productivity.
process monitoring and control (API) www.microscan.com www.techconsystems.com
features, software version control, a NAND
management utility and data pattern
comparison. www.bpmmicro.com
Bliss industries introduces rack to
support all Juki feeders
With Juki being the number one pick-
and-place machine company in the world,
it was only natural for Bliss Industries
to announce the release of several new
models of feeder racks to support Juki’s
700 NF & FF, 2000 CTF feeders. Bliss’
engineering team designed a rack to
support all types of Juki feeders in one
AlphA® cVp-360 pb-free solder
rack. Bliss offers a setup rack, along with
paste features low-Ag sAcX® alloy
22, 36 and 60” racks. All of these racks fit
Cookson Electronics launched ALPHA®
siplAce X-series powered by
Bliss’ standard open style carts, along with
CVP-360 Pb-free, no-clean solder paste
siplAce cpp Multistar
two other feeder racks. Bliss now supports
formulated with its economical low-Ag
The new SIPLACE X-Series powered by
all the Juki and previous Zevatech feeders.
SACX® 0807 and 0307 alloys. ALPHA®
SIPLACE MultiStar delivers the ideal
www.blissindustries.com
CVP-360 delivers excellent printing
combination of chip shooting speed along
characteristics allowing for the use of
with extensive component range capability
suss MicroTec introduces new
more economical Type-3 solder powder,
required for flexible end of line placement.
illumination system for mask
even when 12 mil (300 micron) features
The versatile SIPLACE MultiStar is a
aligners
are being printed using a 5 mil thick (125
high-speed collect&place placement head
SUSS MicroTec launches with the MO
micron) stencil. CVP-360 also adds value
capable of placing up to 24,000 cph with a
Exposure Optics a new illumination system
by allowing high speed printing, and
component range from 01005 to 27mm².
designed for all generations of manual
reduced stencil cleaning frequency. This
The same MultiStar head can also place
and automatic SUSS mask aligners. The
reduces the print cycle time, and lowers
larger components up to 40 x 50mm.
new optical system is based on unique
the cost of consumables, such as stencil
www.siplace.com
microlens arrays of high optical quality
cleaner and under-wipe paper. CVP-360
to provide higher intensity, improved
also has a wide reflow process window,
exposure light uniformity and customized
which indicates resistance to head-in-pillow
illumination shaping. This allows users of
defects. www.cooksonelectronics.com
SUSS MicroTec mask aligners to optimize
the process window and enhance yield
Microscan introduces new QX
in contact and proximity lithography.
platform barcode scanner
MO Exposure Optics (patent pending)
Microscan’s new
has been exclusively developed by SUSS
QX-870 laser barcode
MicroOptics. www.suss.com
scanner adds an
intelligent sweeping
eV group launches new generation
raster scanner and
eVg501 r&D wafer bonding system
greater connectivity to
EV Group (EVG) launched an all-new
the current QX family
Techcon systems 700 series
EVG501 wafer bonding system to address
of high performance
syringe barrels replace
rising cost burdens for its university and
industrial barcode readers. The QX
discontinued syringe
R&D customers. Redesigned based on
technology platform combines both Quick
Techcon Systems, a product group of
customer feedback, the EVG501 features
Connect and X-Mode technologies to
OK International, debuts the 700 Series
the company’s proven core technology
deliver fast network connectivity with
premier dispensing syringe barrels,
platform used throughout its latest
40 – Global SMT & Packaging – August 2009 www.globalsmt.net
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