Title
Association & institutes news
Association & institutes news
load from IPC’s online bookstore at
www.ipc.org/jig-101.
sMTa opens office in Malaysia
Bernie Selva has been appointed the new
call for participation for 2010 ipc
executive coordinator of SMTA Southeast
apeX eXpo™
Asia. Located in Penang, Malaysia, Ms.
IPC—Association Connecting Electronics
Selva will be working closely with the
Industries® invites researchers, academics,
SMTA Penang Chapter, which has achieved
technical experts and industry leaders to
Bga, lga and stack package design
outstanding success both in membership
submit abstracts for the 2010 IPC APEX
and assembly seminar in september
growth and events since its inception last
EXPO at Mandalay Bay Resort and Con-
SMART Group’s “Ball Grid Array, Land
year. She will be coordinating the South-
vention Center, Las Vegas, April 6-9, 2010.
Grid Array and Stack Package Design and
east Asia Technical Conference on Elec-
Expert presentations are being sought
Assembly” seminar will be held Wednes-
tronics Assembly Technologies, to be held
on all relevant electronics’ design, PCB
day, September 2nd at the Bedfordshire
November 19-20, 2009 at the Equatorial
fabrication and manufacturing topics.
Golf Club, Spring Lane, Stagsden,
Hotel in Penang, Malaysia.
Submissions in the areas of package on
Bedford, UK.
Ms. Selva has experience in the
package assembly, printable electronics and
The seminar will cover design, assem-
electronics industry as well as in adminis-
advanced substrates are especially encour-
bly, rework and inspection using optical
tration. A computer science/information
aged. A 300-word abstract summarizing
and x-ray inspection of solder joint. The
technology degree and a secretarial degree
original and previously unpublished work
event is expected to be a sell out based on
give her a strong skill set for the position.
covering case histories, research and discov-
the success of last years QFN and STACK
Penang is the second location in which
eries must be submitted by July 17, 2009.
seminars.
SMTA has opened an office in Asia as part
The submission should describe significant
Theory session included in this event
of their effort to provide professional devel-
results from experiments, emphasize new
will cover:
opment resources on a global basis.
techniques, discuss trends of interest and
For more information or questions
contain a summary of the technical and/or
• BGA and LGA Design rules for printed
about SMTA activities in Malaysia, contact
appropriate test results in the final paper.
board assembly
JoAnn Stromberg,
joann@smta.org or 952-
Proposals are also solicited for full-day
• LGA/QFN footprint and solder mask
920-7682.
layout
and half-day professional development
• PBGA and Ceramic Ball Grid Array
courses on design, printed board and
design
peter Barry to present keynote at
electronic manufacturing processes and
• Use of location marks
sMTai 2009
materials.
• Wetting indicators
The SMTA Annual Meeting and Awards
To submit an abstract or proposal, visit
• Reliability of Tin/Lead and Lead-Free
Ceremony at SMTA International, October
www.IPCAPEXEXPO.org/call-for-papers. mixtures
7, 2009, will feature mission assurance
• BGA and nickel/gold board reliability
manager at Jet Propulsion Laboratory
communication guide on declarable • BGA and LGA Assembly processes and
(JPL) Peter Barry as the keynote speaker.
substance content released impact on yields
Peter will present an overview of the role
With support of IPC and input from
• Screen Printing
that mission assurance management plays
IPC members, the Consumer Electronics
• Placement inspection
in JPL projects. JPL Mission Assurance
Association (CEA)®, DIGITALEUROPE
• Convection and vapour phase reflow
Managers lead a team of assurance special-
and Japanese Green Procurement Survey
• Correct profiling procedures
ists (EEE Parts Engineering, Environments
Standardization Initiative (JGPSSI) have
• Rework plus optical and x-ray inspec-
Engineering, Hardware and Software
tion and process related defects
released, Joint Industry Guide—Material
• Removal procedures for area array
Quality Assurance Engineers, Reliability
Composition Declaration for Electrotechni-
packages
Engineering, and System Safety Engineer-
cal Products—JIG-101 Ed. 2.0, an industry
• Replacement options for packages
ing) to independently assess project risk
materials declaration guide that facilitates
• Optical and x-ray inspection quality
for JPL and NASA. Examples of mission
reporting of material content information
indicators
assurance support for current and future
across the global electrotechnical supply
• Process defect and why they occur
space flight missions will be woven into the
chain. Encompassing the latest regulatory
presentation.
requirements including EU REACH, the
Each delegate will receive a free set of
For more information on SMTAI as
Guide sets minimum requirements for a
SMART Group BGA inspection wall charts
well as the keynote luncheon, contact
material declaration, but does not preclude
and a copy of all the presentation material.
JoAnn Stromberg at 952-920-7682 or
companies from inquiring about the pres-
To book your seminar place or table
joann@smta.org.
ence of additional substances if needed.
top exhibition space contact Tony Gordon
www.smta.org/smtai/special_events
The guide is available for free down-
info@smartgroup.org.
44 – Global SMT & Packaging – June 2009
www.globalsmt.net
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