New Products
New products
Teknek’s award-winning larger industrial
contact cleaning machines. A special
elastomer roller removes dry unattached
particles down to one micron in size from
a variety of substrates. In addition, the
recently launched NanoCleen rubber
rollers can remove particles of below
one micron in size and also has static
panasonic introduces a single-
dissipating properties, which helps prevent
platform modular assembly system
re-attraction of particles to the substrate.
Panasonic Factory Solutions Company
www.teknek.com
of America introduces the NPM (Next
Production Modular), an integrated
Bliss industries redesigns
machine to combine the highest of
solution reaching beyond mounting in a
stencil cart
SMD placement speed with the extreme
single-platform modular assembly system.
Bliss Industries Inc. introduces the
precision of die-bonding. The new
In addition to its interchangeable, plug-
enhanced stencil cart, redesigned to
SIPLACE CA processes dies (both flip-chip
and-play placement heads for nearly any
support the new popular Space Saver.
and die-attach) directly from the wafer,
component, the NPM platform integrates
Bliss’ space saver shelf has half-inch slots to
but it can also place conventional SMT
solder paste inspection (SPI), adhesive
support 50 stencils per shelf. It is available
components with the proven quality and
dispense (ADH), post placement inspection
in a multi-level version as well as staging
speed of all SIPLACE X-Series machines.
(AOI) and screen printing capabilities.
carts. Bliss engineers found a way to change
www.siplace.com
Both heads of each NPM unit work on
the shelf mounting tab, making it fully
both stages to realize the full benefit of
interchangeable with existing Bliss carts in
henkel launches next-gen underfill
the dual lane configuration. Meanwhile,
the field as well as shortening the height
that has it all
the Dual Screen Printer (DSP) module
of the rails that hold the stencils in place.
performs parallel, simultaneous printing of
www.blissindustries.com
two unique products. www.panasonicfa.com
Thin film resistor networks in small
resilient chip encapsulants provide
outline, leadless packages
superior protection
DYMAX Multi-
Cure® 9001-E Series
encapsulants cure in
seconds to provide
superior moisture and
abrasion resistance
and thermal cycle
In a remarkable breakthrough for underfill
performance of
materials development, Henkel has
electronic and
engineered and launched a new underfill
microelectronic
Providing design engineers with a
system that delivers on an unprecedented
assemblies. The fast
significant amount of PC board space
array of complex and demanding
cure minimizes processing and energy costs
savings, TT electronics BI Technologies
requirements, including room temperature
associated with alternative technologies that
has developed a new series of thin film
fast flow, low temperature cure and
require mixing or elevated temperatures
resistor networks. Designated the SFN
reworkability. The new material, Hysol®
for curing. The materials are all one part,
Series, the networks are housed in surface
UF3800™, has been specifically designed
so no mixing is required and viscosity is
mount SON (Small Outline, No Lead)
for use with today’s CSP and BGA devices
consistent. Various viscosities are available
packages, and are available in custom,
and is particularly well-suited for handheld
to provide optimal coverage over various
isolated, bussed and voltage divider circuit
communication and entertainment
geometries.
configurations. www.bitechnologies.com
applications. www.henkel.com/electronics
www.dymax.com
Die-bonding and sMD placement in
Digi-Key announces new open
Teknek introduces new desktop
a single machine
source BeagleBoard
contact cleaning range
Siemens Electronics Assembly Systems
Fueling an active open source community
Teknek has launched a new range of
(SEAS) unveiled a new combined die-
with a flexible, fanless and low-cost
hand-held contact cleaning equipment.
bonding and SMD placement application,
embedded development board, Digi-Key
The dust removal hand tool range applies
SIPLACE CA. Based on the SIPLACE
Corporation announced it is shipping
the same proven technology used in
X-series platform, it is the world’s first
Revision C of the popular BeagleBoard
40 – Global SMT & Packaging – June 2009 www.globalsmt.net
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