Solder joint reliability prediction for chip components, MELFs, TSOPs, SOTs, etc.
model for SAC405/305 Solder joint
Reliability Estimation—A Proposal,”
Global SMT & Packaging, Vol. 8, No.
12, December 2008, pp. 46-48.
8. Engelmaier, W., “Finite Element
Analysis is a Wonderful Tool for
Complex Situations, but…Caveat!,”
Global SMT & Packaging, Vol. 7, No.
5, May 2007, pp. 52-53.
Figure 3. Micrographic cross-section of an extremely aged solder joint showing that the solder has converted into
two IMC layers separated by only lead-rich phase. (Courtesy of Prof. Schmitt-Thomas, TU München, Germany.)
Werner Engelmaier will be giving some of his
solder joint reliability and PCB reliability
workshops at, IPC Midwest Conference in
references:
Surface Mount Solder Attachments.
Schaumburg, IL, September 23-25, 2009, as
1. Engelmaier, W., “How to Estimate
IPC—Association Connecting
well as the SMTA International conference,
Solder Joint Reliability, Part 1,” Global
Electronics Industries, November 1992.
October 4-7, 2009, in San Diego, CA. For
SMT & Packaging, Vol. 7, No. 9,
4. IPC-D-270, Design Guidelines for
details of the workshops go to www.engelmaier.
September 2007, pp. 60-64.
Reliable Surface Mount Technology
com; for more information about the workshops
2. Engelmaier, W., “How to Estimate
Printed Board Assemblies. IPC—
contact engelmaier@aol.com and for the IPC
Solder Joint Reliability, Part 2,” Global
Association Connecting Electronics
conferences www.ipc.org.
SMT & Packaging, Vol. 7, No. 10,
Industries, July 1996.
October 2007, pp. 64-66.
5. IPC-9701, Performance Test Methods
Werner Engelmaier has over 43 years experience
3. IPC-SM-785, Guidelines for
and Qualification Requirements for
in electronic packaging and interconnection
Accelerated Reliability Testing of
Surface Mount Solder Attachments.
technology. Known as ‘Mr. Reliability’ in the
IPC—Association Connecting
industry, he is the president of Engelmaier
Electronics Industries, January 2002/
Associates, L.C., a firm providing consulting
IPC-9701A, February 2006.
services on reliability, manufacturing and
6. Wild, R. N., “Some Fatigue Properties
processing aspects of electronic packaging
of Solders and Solder Joints,” IBM
and interconnection technology. He is the
Tech. Rep. 73Z000421, January 1973.
chairman of the IPC Main Committee on
7. Engelmaier, W., “Creep-Fatigue
Product Reliability. The TGM-ExnerMedal was
bestowed on him in 2009 in Vienna, Austria,
he was elected into the IPC Hall of Fame
2003, and was awarded the IPC President’s
h (?)
Award in 1996 and the IEPS Electronic
Packaging Achievement Award in 1987. He
h (?)
also was named a Bell Telephone Laboratories
Distinguished Member of Technical Staff in
1986 and an IMAPS Fellow in 1996.
More information is available at www.
engelmaier.com, and he can be reached at
engelmaier@aol.com.
Figure 4. Schematic of a solder joint with a J-lead together with a micrographic cross-section of such a solder joint.
(Courtesy of Dimitri Grabbe, AMP Inc., USA.)
Courtesy of Dimitri Grabbe, AMP Inc., USA!
h (?)
h (?)
Figure 5. Schematic of a solder joint with a gullwing lead together with a photograph of such a solder joint.
(Courtesy of James Waldvogel, Intel, USA.)
32 – Global SMT & Packaging – June 2009 www.globalsmt.net
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