Contents
Award Winning Products and Service
Volume 9, No. 7
July 2009
Global SMT & Packaging
is distributed by controlled
circulation to qualified
Contents
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2 A strange month 10
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Trevor Galbraith
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TechNology Focus
No part of this publication may
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10 Metal-based wafer level packaging
retrieval system, transmitted
Shari Farrens, Ph.D., SUSS MicroTec
in any form or by any means 18 Cost reduction of wafer level packaging by using established
electronic, mechanical, materials from non-electronics industries
photocopying, recording or Giles Humpston, Tessera
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ten consent of the publisher.
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No responsibility is accepted for
the accuracy of information
28 Interview—Isao Muraoka, Seika Machinery
contained in the text,
34 Case Study: Reducing recall risk down to no more than
illustrations or advertisements.
three PCB panels
18
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The opinions expressed in the
38 Report: Cookson strengthening its position in Central
articles are not necessarily those
Europe
The Success of Our Customers.
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REGULAR COLUMNS
ISSN No. 1474-0893
© Trafalgar Publications Ltd 4 Practical BGA rework—the simple way
forward with POP paste
Designed and Published by
Bob Willis
28
Trafalgar Publications Ltd,
22 Global recovery looking more & more
EXPECT MORE...
Bournemouth,
likely
United Kingdom
Walt Custer and Jon Custer-Topai
30 Solder joint reliability prediction for chip
Printed by Progress Printing,
components, MELFs, TSOPs, SOTs, etc.
Lynchburg, VA, USA.
Werner Engelmaier
36 IC packaging technology retrospective—
part 5
Joe Fjelstad
OThER REGULAR FEATURES
7 Industry News
36 New Products
42 Global SMT & Packaging Online
44 Association News
48 International Diary
MV-3 Desktop AOI Series
MV-7 Inline AOI Series
A de-paneling machine cuts
the tabs between each PCB to
separate the panel into single
3 MORSE ROAD • OXFORD, CT 06478 boards—page 34.
PHONE: (+1) 203-881-5559 • FAX: (+1) 203-881-3322
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www.globalsmt.net Global SMT & Packaging – June 2009 – 1
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