Title
Association & institutes news
Association & institutes news
roadmap covers five product sectors and 20 ence & Exhibition (EMPC), sponsored by
different manufacturing, component/sub- IMAPS Italy, June 15-18 in Rimini, Italy.
system, design, and business process tech- iNEMI is also a co-sponsor of the event.
nologies. New in this edition are chapters “As one of the longest running confer-
on photovoltaics, solid state illumination ences, EMPC provides an excellent venue
pauls and hillman to present at
and RFID item-level tag (ILT). for iNEMI to update the European-based
electronics Technology ‘09
The 2009 Roadmap was created by electronics industry on our activities,” said
workshop
more than 550 individuals (the largest Grace O’Malley, manager, iNEMI Europe.
Doug Pauls & Dave Hillman from Rock-
number of participants to date) from 250 “We have recently released our 2009
well Collins will present a workshop en-
organizations located in 18 countries on Roadmap, which helps define our techni-
titled ‘Manufacturing Wrong: Case Studies
four continents. The cost of the roadmap cal direction, plus we have active projects
in Non Conformance’ at the conference-
is $250 for non-members ($325 outside addressing environmental concerns, the
exhibition-networking event ‘Electron-
North America). For more information technology challenges of miniaturization,
ics Technology ‘09 to be held on 30th
and to order, go to
www.inemi.org/cms/ and medical electronics. We look forward
September/1st October 2009 at the Ricoh
roadmapping/2009_Roadmap.html. to discussing several of these initiatives at
Arena, Coventry. Doug Pauls is a leader in
the conference.”
the IPC cleaning, coating, and materials
Technical Paper: Pb-Free Alloy Al-
test fields. Dave Hillman is a leader in the
ternatives. A paper entitled “Addressing
IPC Solderability task groups and heavily
Opportunities and Risks of Pb-Free Solder
involved in the electronics materials fields.
Alloy Alternatives,” will summarize results
The workshop is designed around case
of iNEMI’s Pb-Free Alloy Alternatives
studies, each chosen from the experiences
ipc J-sTD-075-De available in
Project, which addressed the opportunities
german
of the presenters, in which manufacturing
and risks of new Pb-free alloys. The discus-
IPC — Association Connecting Electron-
problems were identified, diagnosed, root
sion will provide results from the project’s
ics Industries® announces the German
causes determined, and corrective actions
analysis of state-of-the-industry knowledge
language release of J-STD-075, Classifica-
put in place. The intent is to provide the
about Sn-Ag-Cu alloy alternatives and iden-
tion of Non-IC Electronic Components for
attendee with troubleshooting methodolo-
tify focus areas for closing key gaps. The
Assembly Processes. Developed jointly by
gies and practical knowledge of remedial
presentation will also report on progress in
IPC, JEDEC and ECA (Electronic Compo-
measures or actions to take. Topics will
updating or creating industry standards to
nents Association), this document provides
include:
manage the introduction and use of new
test methods and classification levels to
alloys, and will describe iNEMI’s plans to
• Board Finishes identify the worst-case thermal process limi-
investigate thermal fatigue reliability of new
• Evaluating / Qualifying Material tations for all electronic components that
alloys.
Sets may be processed as part of a circuit card
Poster Session: iNEMI Technology
• Soldering Processes assembly, including passives, connectors,
Focuses. “Closing Technology Knowledge
• Cleaning Processes switches and other devices.
Gaps: Projects Arising from the iNEMI
• Cleanliness Assessment J-STD-075-DE may be purchased
Technology Roadmap” will review the
• Conformal Coating $26(U.S.) for IPC members or $52(U.S) for
consortium’s goals in its three main tech-
• Rework and Repair Processes nonmembers. For more information or to
nology areas: energy and the environment,
• Field Returns and Failure Analysis purchase, visit the IPC online bookstore at
medical electronics and miniaturization.
• Costs of Non Conformance
www.ipc.org/onlinestore.
It will also cover results from initiatives in
(CoNC) Questions and comments about J-STD-
each of these three areas, including projects
• Enterprise Sourcing: A Cancer to 075-DE or inquiries regarding participa-
focused on Pb-free alloys and HFR-free sub-
Be Fought tion in continuing standards development
strates, higher density testing and nanosol-
projects may be directed to Jack Crawford
For more information contact: Mike Judd,
ders, and medical components reliability.
at
JackCrawford@ipc.org.
PR director SMART Group, mjudd@mjm-
EMPC 2009 will be hosted by IMAPS
marketing.com or +44(0) 118 978 4589.
Italy and is scheduled for June 15-18
in Rimini, Italy. Co-sponsors include
iNEMI, STMicroelectronics, Associazione
Microelettronica, Elettronica, Semicondut-
iNeMi presentations scheduled at
tori (AMES) and IEEE’s Components,
eMpc 2009
2009 iNeMi roadmap available to
Packaging and Manufacturing Technology
industry
The International Electronics Manufac-
(CMPT) Society.
www.empc2009.org
turing Initiative (iNEMI), an industry-led
The International Electronics Manufactur-
consortium, will showcase several of its
ing Initiative (iNEMI) has made its 2009
activities in presentations at the European
Roadmap available for sale. This latest
Microelectronics and Packaging Confer-
44 – Global SMT & Packaging – June 2009
www.globalsmt.net
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