New Products
functions as a complete dispensing system,
polyonics
allowing users to dispense a wide variety of
premiers new
materials with repeatability and precision.
materials
www.tridak.com
Polyonics in-
troduced new
materials: XF-300 is
a 5-mil coated poly-
amide (Nylon®),
pressure-sensitive
label material, de-
signed for barcode
or alphanumeric
identification of
connectors, wires
and cables. XF-596
(1 mil) and XF-597
(2 mil) high-gloss
polyimide label
New aqueous developer-stripper
materials for higher
antifoam agent
barcode print
RBP Chemical Technology Inc has an-
density have been
nounced the immediate availability of
added to the com-
FoamFREE™ ONE, an aqueous anti-
pany’s Thermog-
foaming agent for image developers and
ard™ product line
strippers, and for solder mask developers.
of high-temperature
The new RBP product suppresses foaming
resistant label ma-
at very low concentrations, without leaving
terials. XF-596 and
residue behind or in the machine. RBP
XF-597 are coated
FoamFREE ONE is very effective at low
with a high opacity,
concentrations, and can be added directly
gloss white topcoat
to the sump or metered with an automatic
specifically designed
dosing system.
www.rbpchemical.com
for thermal transfer
printing. XF-509 is
picoDot™ jet dispensing systems
a special 1-mil poly-
aid product miniaturization
imide film coated
EFD, Inc., a subsidiary of Nordson Cor-
with a high opacity,
poration, introduced the new PicoDot jet
black topcoat, and
dispensing systems, which bring significant
is designed for
new capabilities to EFD’s extensive line of
thermal transfer
precision fluid dispensing systems. Because
printing with white
the PicoDot systems do not contact the
resin based ribbons.
substrate, they will enable manufacturers
www.polyonics.com
to deposit controlled amounts of fluid on
hard-to-access areas, uneven surfaces, or in
aiM Ws488
applications where a conventional dispens-
water soluble
ing needle cannot be used—at speeds up to
solder paste
150 dots per second.
www.efd-inc.com
AIM’s new WS488
water soluble solder
Koki head-in-pillow solder paste
paste is designed to
approved by major telecom
wet virtually any sol-
manufacturer
derable electronic
Koki Company Ltd. (Tokyo, Japan) an-
surfaces, compo-
nounced approval by a major Japanese
nents, assemblies
manufacturer of telecommunications
and substrates.
infrastructure of the S3X-48-M406 series
WS488 is compat-
solder paste, developed specifically to ad-
ible with all leaded
dress head in pillow defects. S3X48-M406
and lead-free alloys
solder paste offers excellent printability on
and has been devel-
very fine pitch (0.4Mmm/16 mil) and CSP
oped for use in a
devices with long stencil idle time. Melt-
wide range of appli-
ing & wetting is excellent, and specially
cations. WS488 of-
formulated flux chemistry ensures very low
fers superior slump
voiding.
www.christopherweb.com
resistance, as well
www.globalsmt.net Global SMT & Packaging – June 2009 – 39
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