PoP
NEW!
Package on Package
Amkor is offering daisy chain samples of their award winning bottom
Package Stackable Very Thin Fine Pitch BGA (PSvfBGA) and their top PoP
D
optimized for Package on Package (PoP) requirements. PoP has become
umm
the solution of choice for an increasing number of mobile consumer
applications for 3D integration of logic and memory devices. Amkor’s
PSvfBGA is a high density fine pitch BGA package supporting logic or
y C
ASIC devices including base band, application and image processors. PoP
omp
stacking allows the OEM greater device, supplier and time to market flex-
ibility by sourcing the bottom and top devices from their preferred logic
onen
and memory suppliers and then stacking the devices in the PWB surface
mount assembly flow. A wide range of leading wireless and mobile
integrated device manufacturers are relying on Amkor’s technical and
Stacked Package
ts
industry leadership in PoP.
PoP Package on Package—Mating Top and Bottom Daisy Chain Samples
Part Description I/O Count Pitch Body Size
Ball Ball Quantity
Matrix Alignment Per Tray
12mm Body Size
A-PoP128-.65mm-12mm-DC 128 (top package) .65mm 12mm 18x18 Perimeter 152
A-MPoP128-.65mm-12mm-DC 128 (middle package) .65mm 12mm 18x18 Perimeter 152
A-PSvfBGA305-.5mm12mm-DC 305 (bottom package) .65mm (top) - .5m (bottom) 12mm 23x23 Perimeter 152
14mm Body Size
A-PoP152-.65mm-14mm-DC 152 (top package) .65mm 14mm 21x21 Perimeter 119
A-PSvfBGA353-.5mm-14mm-DC 353 (bottom package) .65mm (top) - .5m (bottom) 14mm 26x26 Perimeter 119
15mm Body Size
A-PoP160-.65mm-15mm-DC 160 (top package) .65mm 15mm 22x22 Perimeter 112
A-PSvfBGA604-.5-15mm-DC 604 (bottom package) .65mm (top) - .5m (bottom) 15mm 28x28 Perimeter 112
Notes Part Description System
Amkor
Fine pitch 0.5mm bottom package footprints
A-PSvfBGA305-.5mm-12mm-DC-Alloy
Stacked package heights of 1.2mm to 1.6mm available in a variety of
Package Stackable (SAC305, SAC405,
Very Thin
configurations (see Stack Up table on following pages)
SAC105, and SAC125Ni)
Fine Pitch BGA
Wafer thinning / handling < 100 µm I/O Count
Daisy Chain
(Bottom Side Only)
Consistent product performance and reliability
Body Size
Pitch
Package configurations compliant with JEDEC standards
Moisture Resistance Testing is JEDEC Level 3 @ 260 °C
Ball Diameter
Temp Cycle –55/+125 °C, 1000 cycles
I/O Count Ball Diameter
HAST 130 °C, 85% RH, 96 hours
128 0.45mm
Temp/Humidity 85 °C/85%RH/1000 hours
152 0.45mm
High Temp Storage 150 °C, 1000 hours 305 0.3mm
Board level Thermal Cycle –40/+125 °C, 1000 cycles
353 0.3mm
Parts packaged in JEDEC matrix trays
PoPs are only available Pb-free (not Tin-Lead). Available alloys are: For recommended kits see pages
SAC305, SAC405, SAC105 and SAC125Ni*
88 and 92.
*SAC125Ni (1.2%Sn/0.5%Ag/.05%Cu/98.25%Ni) is only available for
bottom packages.
It is recommended that parts be pre-baked at 125 °C for 48 hrs before
Please Note
using parts regarding moisture concern.
Amkor supporting data is available on our website for: Board
PoP’s are not available without solder balls.
Level Reliability (BLR), PoP application notes, PoP Stencil &
Stacking paper for SMT Conditions.
See drawings on the following pages (6–19) for
IMAPS and SMTA White Paper Articles for additional
additional technical data. Color coded version avail-
supporting data available on our website:
able on our website:
www.practicalcomponents.com www.practicalcomponents.com.
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
Practical Components, Inc. Tel: 1-714-252-0010 Fax: 1-714-252-0026
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