(V)FQFP
FusionQuad®
NEW!
Amkor’s FusionQuad® represents a breakthrough in leadframe-based plas- acteristics with short signal paths to the bottom lands and high power
ts
tic packaging through the effective integration of ExposedPad™ QFP and dissipation capability with the solderable exposed die attach paddle.
MLF® technologies. FusionQuad® is based upon the addition of exposed
Amkor’s FusionQuad® provides an ideal package format for most IC
onen
bottom lands within a standard VQFP package format. The novel integra-
semiconductor technologies including advanced mixed signal SoCs,
tion of bottom lands provides a cost-effective platform for increased lead
motor drivers, MCUs, ASICs, DSPs and a variety of others. FusionQuad® is
count in a small form factor. FusionQuad® not only extends the I/O range
omp
particularly well suited for applications requiring superior electrical or
of classic leadframe packaging to nearly 400 unique pins, it also delivers
thermal performance in a cost constrained environment including hard
y C
an approximate 50% reduction in package size for a given leadcount. Ad-
disk drives, laptop PCs, Ethernet communication, digital television, data
ditionally, FusionQuad® provides excellent RF electrical performance char-
conversion and many others.
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FusionQuad®
Part Description
Total Lead External Internal Body Body Lead Quantity
Count Leads Leads Size Thickness Pitch Per Tray
Single Row
A-(V)FQFP176(128/48)-14mm-.4mm 176 128 48 14mm sq .8mm .4mm 90
A-(V)FQFP184(128/56)-14mm-.4/.5mm 184 128 56 14mm sq .8mm .4/.5mm 90
A-(V)FQFP196(148/48)-16mm-.4/.5mm 196 148 48 16mm sq .8mm .4/.5mm 84
A-(V)FQFP220(148/72)-16mm-.4mm 220 148 72 16mm sq .8mm .4mm 84
A-(V)FQFP280(224/56)-24mm-.4/.5mm 280 224 56 24mm sq 1.0mm .4/.5mm 40
A-(V)FQFP304(224/80)-24mm-.4mm 304 224 80 24mm sq 1.0mm .4mm 40
Dual Row
A-(V)FQFP216(100/116)-14mm-.5mm 216 100 116 14mm sq .8mm .5mm 90
FusionQuad®—176 pin Single Row Design
Standard 14mm x 14mm VQFP
128LD 0.5mm External Lead Pitch
Mold Compound Gold Wire
less than
0.8mm
1.00mm
Die Body
Seat Height
SOH: .05
Cu Leadframe Exposed Lands Exposed Die
nominal
Paddle
Single Row Exposed Land Design
Additional 48 pins on
bottom at 0.5mm Pitch
Order Number: A-VQFP176(128/48)-14mm-0.5-DC-Sn
FusionQuad®—216 pin Dual Row Design
Standard 14mm x 14mm VQFP 100L
0.5mm External Lead Pitch
Mold Compound Gold Wire
0.8mm
less than
Die Body
1.00mm
Seat Height
SOH: .05
Cu Leadframe Exposed Lands Exposed Die
nominal
Paddle
Double Row Exposed Land Design
Additional 116 pins on
bottom at 0.5mm Pitch
Order Number: A-VQFP216(100/116)-14mm-0.5-DC-Sn
Practical Components, Inc.
www.practicalcomponents.com
klaphen@practicalcomponents.com
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