TitleAssociation & institutes news
Association & institutes news
this position, has transitioned to director T2: Next Generation Technologies in Elec-
of certification programs, due to the large tronic Packaging and Production
growth of activity in this area.
T3: The Reality of Reliability of Lead-Free
With more than 20 years of electronics
Updated World PCB Production and
industry experience, Schuld most recently T4: Advanced Component Packages &
Laminate Market Report
served as senior customer quality engineer Processes
IPC—Association Connecting Electronics
at Qualcomm CDMA Technologies in San
T5: Aspects and Impacts of REACH T6:
Industries recently issued its World PCB
Diego. In addition, he held various quality,
Common Failure Modes in Electronic
Production and Laminate Report for the
evaluation and component engineering
Packages and Assemblies and How to
Year 2007. Based on the best data available,
positions at several IPC member compa-
Avoid Them
the report presents estimates of printed
nies, including Motorola, Hitachi, Texas
circuit board (PCB) production and lami-
Instruments and Honeywell. T7: Construction, PCB Design and As-
nate market by region and product type
Schuld holds a Bachelor of Science sembly of BGA and Leadless Packages for
worldwide.
degree in electrical engineering technology Pb-Free
The report estimates that the world
from the Milwaukee School of Engineer-
Contact Melissa Serres Marx, Melissa@
PCB market continued to expand in 2007,
ing. He can be reached at +1 847-597-2848
smta.org or 952-920-7682 for more
but at a slower growth rate than in previous
or
KevinSchuld@ipc.org.
information.
years. At nearly $50.3 billion, worldwide
PCB production grew 5.6 percent in 2007.
PCB growth has outpaced the growth of
most other industries, thanks to growing
SMTA announces International
demand for electronic products.
Wafer-Level Packaging Conference
Highlights of the report include an
(IWLPC) call for papers
Device Packaging 2009—Look at
overview of the PCB industry in 2007,
The SMTA, in conjunction with Chip
what we have in store for you!
PCB production details by region, special
Scale Review magazine, has released a call
The Device Packaging Conference
analysis of flexible printed boards, laminate
for papers for the 6th Annual International
continues to grow by leaps and bounds.
market details by region, and historical
Wafer-Level Packaging Conference and
The conference’s technical program now
trends in worldwide PCB production.
Tabletop Exhibition (IWLPC) to be held
features six technical tracks on 3D packag-
According to the report, the top-ten
October 29-30, 2009 at the Marriott Santa
ing, MEMS, flip chip, wafer level packag-
PCB producing countries accounted for 92
Clara Hotel in Santa Clara, CA. Interested
ing, biomedical devices and new in 2009...
percent of world PCB production in 2007,
parties are invited to submit a 300-word
power LED devices, as well as eight half-day
based on value. China, Hong Kong and Ja-
abstract for this programby uploading them
professional development courses, two
pan together accounted for more than half
to
www.iwlpc.com/call_for_papers.cfm on or
panel discussions on 3D integration tech-
of total world production. China’s growth
before March 17, 2009.
nologies, applications and roadmaps, and
in PCB production slowed to 16 percent,
The conference expands to three tracks
wafer level packaging, plus an interactive
but still continued to outpace most other
in 2009 with two days of papers covering:
poster session.
countries. The United States, ranked fifth,
• Wafer-level packaging
The exhibit hall has sold out for the
produced eight percent of the global total
• 2D/3D stacked packaging
fourth consecutive year with a growing wait
in 2007.
• Integrating ICs, MEMS,
list.
The report is not for sale to the general
MOEMS, wireless and
The 5th Annual International Confer-
public. It is available only to IPC members
photonic devices with novel
ence and Exhibition on Device Packaging
free of charge and can be accessed at www.
processes
will be held March 9 - 12, 2009 at the
ipc.org/members-only. For information on
Visit
www.iwlpc.com/call_for_papers.cfm
Radisson Fort McDowell Resort & Casino
IPC membership, visit
www.ipc.org/member-
to view the complete call for papers and to
in Scottsdale/Fountain Hills, Arizona.
ship.
submit an abstract.
Also, the Global Business Council
(GBC) has again co-located its spring
IPC names Kevin Schuld as new
SMTA Boston Academy
conference, March 8-9, focusing on supply
director of assembly technology
SMTA Boston Academy will be held April
chain development for 3D packaging.
IPC—Association Connecting Electronics
22-23, 2009 at the Boston Convention
Visit
www.imaps.org/devicepackaging and
Industries® hasadded Kevin Schuld to
Center in conjunction with NEPCON
see the outstanding presentations planned.
its staff as director of assembly technol-
East. This year’s program will feature a
ogy within the association’s technical
series of half-day and full-day courses led by
department. Schuld will be responsible
leading instructors in the industry:
for working with technical committees on
standards development in the assembly
T1: SMT Process Fundamentals for Tin-
technology area. Jack Crawford, formerly in
Lead, Lead Free and Mixed Assembly
58 – Global SMT & Packaging – March 2009
www.globalsmt.net
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