New Products
preforms worldwide. EZReball™ reballing
preforms are now available in ball sizes
down to 8 mils (0.20 mm). These preforms
can accommodate devices down to 0.4
more reliable and robust system.
mm pitch sizes. Solder sphere alloys are
www.pillarhouseusa.com
available in lead-free, tin-lead and high
temperature alloys.
www.solder.net
Poly-Form™ flexible adhesive
preforms
Multi-Seals, Inc., introduced an innovative
alternative to liquid adhesive for compo-
nent assembly. Multi-Seals F05 Poly-forms
are flexible pre-shaped adhesives designed A floating center support mechanism rises
for bonding diverse materials, includ- upward and prevents larger PCBs from
ing metals, plastics, and glass. F05 has flexing during the lowering process onto
negligible vertical flow, which keeps the ad- the edge belts. Load and Pass mode func-
hesive contained in precisely defined areas. tions are standard, allowing this system
The pre-shaped copolymer prevents drips to be placed between a magazine handler
and dispensing inconsistencies typical of and screen printer. By adding a PROMA-
liquid adhesives. Adhesive placement is TION’s touch panel option, the system is
FINE LINE STENCIL sets new stencil
highly consistent from bond to bond. The transformed into the prestigious ‘Signature
performance standards
durability and flexibility of F05 Poly-forms Series’ offering auto width, offset width, se-
FINE LINE STENCIL, a division of FCT
facilitates manual and automated handling quence tracking with digital readout, PCB
Assembly and a manufacturer of stencil
and increases production rates. F05 can be counting and more.
www.Pro-mation-Inc.com
products, set new stencil performance
pre-shaped in multiform configurations to
standards with the release of its UltraSlic-
accommodate a broad range of applica-
FG solder paste stencil. The UltraSlic-FG
tions.
www.multi-seals.com
offers superior paste release below surface
Fiducials-on-the-Fly Technology
area ratios of 0.5. Using the latest stencil
locates fiducials 5X faster
laser technology and Datum Alloys’ new
Asymtek introduced a new Fiducials-on-
Fine Grain stencil material, exclusively
the-Fly option for its Spectrum-900 series
distributed by Ed Fagan, Inc., UltraSlic-FG
dispensing platforms. Fiducials-on-the-Fly,
stencils provide superior aperture registra-
ideal for any application with 8 to 1800
tion, higher performance and lower cost,
fiducials per workpiece, is up to five times
with the option of same day turnaround
faster than the standard stop-and-capture
times.
www.finelinestencil.com
mode for locating fiducials on printed
Aries Electronics CSP/BallNest
Pillarhouse Jade MkII selective
circuit boards or parts prior to dispensing,
Hybrid Socket provides consistent
soldering machine
reducing time spent performing this es-
test and burn-in down to 0.30 mm
The success of the Jade selective soldering
sential, non-dispense routine can increase
pitch
machine continues with the introduction
units per hour (UPH) of completed parts
Aries Electronics’ new patented CSP/
of the MkII system. The proven mechanics
by as much as 35 percent.
www.asymtek.com.
BallNest Hybrid Socket, suitable for proto-
typing, test or burn-in of CSP (chip scale
of the machine remain largely unchanged
PROMATION enhances its PCB
package), BGA (ball grid array), microBGA
with a few mechanical enhancements
DeStacker system
and LGA (land grid array) devices, features
added to reduce LTF. The electrical and
New for 2009, PROMATION has
a lid that nests each ball termination into
electronic systems have been completely
enhanced the exterior style of its ASD-700
the socket for a reliable connection. The
updated and replaced with the next genera-
PCB DeStacker system. The ASD-700
socket can be used on any device with a
tion of the Pillarhouse controls. Many of
PCB DeStacker provides a small footprint
0.30 mm pitch or larger.
www.arieselec.com
the circuit boards have now been replaced
for loading PCBs at the front of the line.
with a main control board reducing the
The top-load system holds up to 80 PCBs
number of wiring interconnects making a
ranging in size from 2” x 3” to 18” x 20”.
56 – Global SMT & Packaging – March 2009
www.globalsmt.net
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