APEX technology pr
Title
eview: What’s on the show floor?
APEX technology preview:
What’s on the show floor?
Global SMT & Packaging magazine brings a preview of just
some of the innovations and new technology to be showcased
on the exhibition floor at IPC APEX Expo 2009.
the Helix programming system, device- and low running costs provides a tremen-
programming customers can receive the dous cost of ownership advantage.
quality of automated device handling at a
www.btu.com
lower price point than traditionally avail-
able.
www.bpmmicro.com cincinnati sub-Zero
Booth #1547
Cincinnati
Sub-Zero (CSZ)
will release a new
line of vertical
thermal shock
chambers that
combine high
performance,
small footprint,
aqueous Technologies
and an array of
Booth #2247
standard features
Aqueous Technologies Corp. will exhibit
BTu international to offer excep-
the Trident Duo, its fourth-generation
Booth #2424 tional value. The
automatic defluxing system, reportedly the
The Pyramax 100A reflow oven features hot zone has a temperature range of 70°C
fastest batch-format defluxing system avail-
100 inches of heated length and eight to 210°C and the cold zone has a tempera-
able. The system is capable of defluxing
zones, 350ºC maximum temperature, ture range of -75°C to 190°C. The chamber
and cleanliness testing up to 200 4 x 6”
flexible platform configuration, low power may also be operated as an independent
(101 x 152 mm) boards and up to 28 18 x
consumption and a comprehensive menu thermal cycling chamber—the value of two
20” (457 x 508 mm) boards per hour.
of options. The combination of high yield chambers in one system..
www.cszinc.com
www.aqueoustech.com
cobar solder products
BpM Microsystems
Booth #2111
Booth #1279
Cobar Solder Products will exhibit a
Automating the device programming cycle
complete range of lead-free products and
has always been the preference in electron-
advanced fluxes based on Nihon Superior’s
ics manufacturing, but until now, the cost
patented SN100C-alloy. Also on display
of this equipment exceeded most manufac-
will be Cobar’s XF3 lead-free solder paste,
turing budgets. W ith the introduction of
developed to accommodate extended f
46 – Global SMT & Packaging – March 2009
www.globalsmt.net
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