New Product Focus: Breaking old placement head paradigms
Red indicates components placed with Multistar head
Figure 2. Component distribution for a typical cell phone product.
Figure 4. Siplace CPP MultiStar placement head.
of shields that get head, a 28% output increase was realized
placed at the end for the topside of the board along with
of the line. After a 12% increase in output for the bottom
Red indicates components placed with Multistar head
configuring the side placements. In this application, the
SIPLACE X-Series 28% output improvement is the benefit of
Figure 3. Component distribution of an industrial product.
machines with the MultiStar™ head’s ability to take on
MultiStar™ heads, additional placement load from the slower
the line output twin head thereby resolving this bottleneck
consequences of changing heads, such
increased by 19%, or a reduction in cycle condition.
as the non-productive time generated dur-
time of 2.5 seconds per panel. The gain is a Most—but not all—placement heads
ing the head change and re-optimization,
result of the MultiStar’s™ faster placement suffer a considerable derate factor when
the increased investment cost for addition-
of mid-range components in combination placing any components larger than the
al heads, the increased maintenance effort
with a better-optimized balance of compo- chip level. Obviously you won’t find this
and, in general, more complex logistics to
nents between heads/gantries. information written in the machine speci-
manage on the production floor.
Figure 3 shows the component dis- fications. When evaluating a machine’s
Without a doubt, the most important
tribution of an industrial product. The capability to meet the demands of your spe-
appraisal of a placement head design
board has 317 placements bottom and 82 cific production requirements, it behooves
is determined by its actual placement
placements on the topside. The bottom you to look twice at the placement head
performance across a variety of board types
components are all small passives (chips), concept to understand exactly how it will
and component ranges. Figure 2 illustrates
and therefore the topside components are perform in your application.
the component distribution for a typical
primarily mid-range and larger components
cell phone product. This particular cell
including SOICs, tantalums, BGAs, and
phone is a four-up panel and has 1312
QFPs. The line is run with a common
total components. As expected, the great-
feeder setup allowing either board side to
est percentage (91%) of components are
run without having to exchange any feed-
small passives. Of the remaining 9%, most
ers or trays. After retrofitting the Siemens
are mid-range in size with the exception
X-Series line with the new MultiStar™
42 – Global SMT & Packaging – March 2009 www.globalsmt.net
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