TitleAssociation & institutes news
Association & institutes news
email
info@smartgroup.org. PCB production details by region, special
For exhibition enquiries please contact; analysis of flexible printed boards, laminate
Marilyn Driscoll on 01763 838554 or email market details by region, and historical
marilyn@ElectronicsTechnology.co.uk. trends in worldwide PCB production.
According to the report, the top-ten
PCB producing countries accounted for 92
sMarT group conference,
percent of world PCB production in 2007,
exhibition & networking event
based on value. China, Hong Kong and Ja-
A SMART Group conference, exhibition
Tin Tin in the land of the
pan together accounted for more than half
and networking event will take place 30
Measurement scientists!
of total world production. China’s growth
September-1st October 2009 at the Richoh
Scientists at the National Physical Labo-
in PCB production slowed to 16 percent,
Arena in Coventry, UK.
ratory (NPL) are helping the electronics
but still continued to outpace most other
SMART GROUP vice-chairman
industry move to using lead-free solder
countries. The United States, ranked fifth,
Graham Naisbitt speaking at the announce-
alloys by researching how the potentially
produced eight percent of the global total
ment of this event said, “I have long felt
damaging ‘tin pest’ and ‘tin whiskers’ could
in 2007.
that the days of traditional exhibitions are
affect it. NPL has been using its expertise
The report is not for sale to the general
over, thanks to the Internet, whereas
in the area of studying the allotropic phase
public. It is available only to IPC members
technical conferences have proved to be
transformation in tin and its alloys, com-
free of charge and can be accessed at www.
increasingly popular. Networking also
monly known as tin pest, to measure the
ipc.org/members-only. For information on
remains an essential benefit, as it does in
implications of adopting lead free solder
IPC membership, visit
www.ipc.org/member-
all walks of life, to ensure that you remain
manufacturing practices. NPL has just
ship.
up-to-date with current events that might
received funding from the Department for
have a direct impact on your own destiny.
Business, Enterprise & Regulatory Reform
“SMART Group has consistently
(BERR). It is committed to co-fund this
proved to be THE most pro-active force in
work with industry support and has al-
the electronics industry in regard to both
located a budget of £77,944 over a two-year
technical conferences and networking
period to research the problem of tin pest. sMTa announces international
events.
NPL are looking for further industrial part- Wafer-level packaging conference
“Nevertheless, having the opportunity
ners and are keen to hear from interested (iWlpc) call for papers
to directly review new technology, it natu-
folk.
www.npl.co.uk The SMTA, in conjunction with Chip
rally follows that running an exhibition Scale Review magazine, has released a call
alongside a conference and a networking for papers for the 6th Annual International
event would provide the perfect environ- Wafer-Level Packaging Conference and
ment to achieve all of these goals at one Tabletop Exhibition (IWLPC) to be held
time. October 29-30, 2009 at the Marriott Santa
“Now the SMART Group, together Clara Hotel in Santa Clara, CA. Interested
with event management partner M2 ipc issues updated World pcB parties are invited to submit a 300-word
Events, brings all of this to fruition with production and laminate Market abstract for this programby uploading them
Electronics Technology—THE Conference—
report
to
www.iwlpc.com/call_for_papers.cfm on or
Exhibition—Networking Event.”
IPC—Association Connecting Electronics
before March 17, 2009.
Marilyn Driscoll, one of the organisers
Industries recently issued its World PCB
The conference expands to three tracks
of the exhibition believes that a conference
Production and Laminate Report for the
in 2009 with two days of papers covering:
lead exhibition’ is the only way to guaran-
Year 2007. Based on the best data available,
• Wafer-level packaging
tee exhibitors seeing the right audience.
the report presents estimates of printed
• 2D/3D stacked packaging
She further commented that the days of
circuit board (PCB) production and lami-
• Integrating ICs, MEMS,
the all encompassing event in the UK are
nate market by region and product type
MOEMS, wireless and
long gone and that this cost-effective for-
worldwide.
photonic devices with novel
mat is what is required. “Together with the
The report estimates that the world
processes
SMART Group we will be doing all that we
PCB market continued to expand in 2007,
Visit
www.iwlpc.com/call_for_papers.cfm
can to ensure that this double header deliv-
but at a slower growth rate than in previous
to view the complete call for papers and to
ers quality to all participants!”
years. At nearly $50.3 billion, worldwide
submit an abstract.
A call for papers for the conference is
PCB production grew 5.6 percent in 2007.
on the SMART Group website.
PCB growth has outpaced the growth of
A number of companies have already
most other industries, thanks to growing
expressed their interest in the exhibition.
demand for electronic products.
For enquiries on the conference please
Highlights of the report include an
contact Tony Gordon, on 01494 465217 or
overview of the PCB industry in 2007,
58 – Global SMT & Packaging – March 2009
www.globalsmt.net
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