TitleNew Products
New products
group of OK International, introduces its
New vision systems brochure
new Bench Top Fluid Dispensing Product
With the latest technology brochure in its
Guide, which includes dispensers, 700
Siplace SMT Insights series, the Siplace
Series consumables, and dispensing tip
team informs the reader about the jobs
options.
of modern vision systems and how they
www.techconsystems.com
work, in a compact and richly illustrated
format that is not only of interest for vision
graphical user surface makes controlling
Datapaq introduces easy oven
experts.
and programming simple. Additionally, if
setup (eos) software for automatic
An analysis of machines from different
more placement capacity is necessary in the
recipe calculations
manufacturers uncovers great differences
future, Essemtec’s investment protection
Datapaq’s new Easy Oven Setup (EOS)
in their technology and implementation,
program makes the changeover easy.
software for reflow ovens is an easy-to-use
with significant consequences for each ma-
www.essemtec.com
software program that automatically cal-
chine’s process quality. What makes the dif-
culates the best reflow oven settings based
ference? How do some placement machines
on your product and process limits. EOS
achieve such outstanding values in terms
uses a newly developed search engine to
of speed and precision? The “SMT Insights
process thousands of oven settings before
Vision” technology brochure provides the
recommending the best options to the user.
answers.
www.siplace.com
Users simply run their product through the
oven to create a profile, enter the process
Nihon superior introduces Ns-F850
limits and EOS calculates the optimal
flux for lead-free wave soldering
recipe. EOS eliminates the need to conduct
IMAGE Nihon NS-F850 Flux.jpg
repeated trial and error experiments and
Nihon Superior Co. Ltd., introduced
establishes your oven recipe effortlessly.
NS-F850 rosin-based flux for lead-free wave
www.datapaq.com
soldering. NS-F850 ensures excellent wet- Vitronics soltec selective soldering
ting of all PCB and component substrates features pcB warpage compensation
Krayden and Dow corning introduce
to deliver maximum through-hole fill and Board warpage or planar shape distortion
hM-2520 assembly sealant
facilitates the solder drainage that ensures can affect precision selective soldering
Krayden, Inc., and Dow Corning, in-
minimum bridges and icicles. It is the ideal results and process repeatability if it is not
troduce new Dow Corning® HM-2520
flux for lead-free wave soldering. Addition- compensated for during soldering. Varying
assembly sealant with improved green,
ally, the rosin-based flux ensures that the differences in distance between the PCB
tensile strength. Specially formulated for
full reliability potential of SN100C lead- and the solder wave can result in irregular
automated assembly, new Dow Corning®
free solder is realized. results and soldering defects. Vitronics
HM-2520 Assembly Sealant combines the
www.nihonsuperior.co.jp Soltec now offers PCB warpage compensa-
immediate green strength of a hot melt
tion as a feature of its advanced mySelective
adhesive with the long-term performance
essemtec Begins 2009 with a new 6748 selective soldering machines. This
of a reactive silicone sealant and improved
entry-level pick-and-place system compensation ensures that the points to
resistance to movement during cure and at
Essemtec’s new SMD pick-and-place be soldered on an assembly are always the
high temperatures under load.
machine CSM7200 is perfect for entrance same precise height above the wave, even if
www.krayden.com
into fully automatic SMD placement and is there is slight warpage of the board.
especially suitable for the flexible manu-
www.vitronics-soltec.com
reballing preforms for electronic
facturing of small lot series. The machine
packages down to 0.4 mm pitch
fabricates all current components up to 40 Techcon systems introduces bench
BEST Inc. announces the release of the fin-
x 40 mm and offers an integrated dispens- top fluid dispensing product guide
est pitch, smallest ball diameter reballing
ing system for glue or solder paste. The ITechcon Systems, a product
54 – Global SMT & Packaging – March 2009
www.globalsmt.net
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