Title
Show preview: IPC APEX Expo 2009
FcT recovery
Booth #846
FCT Recovery is committed to providing
a high-quality, reliable and transparent
service to its customers and offers recovery
services for lead-free, tin/lead dross and
scrap including solder paste and wipes in
quantities as small as 25 lb.
www.fctrecovery.com
essemtec
reflow profiles without the use of nitrogen.
Booth #2225
With XF3, wetting on all common metal
The new SP150 fulfils the long-term
surfaces is excellent, yielding shiny joints
demands of many small and medium size
reminiscent of leaded solders.
enterprises: a semiautomatic system with
www.cobar.com
integrated stencil cleaning, controlled
printing process and digital vision system.
This affordable machine reproducibly
prints the finest structures even in larger
FcT solder
series. Because of the space saving front
Booth #846
drawer, the SP150 fits into every produc-
FCT Solder invites visitors to bring their
tion.
www.essemtec.com
lead-free projects and questions to its
booth for a SN100C® consultation.
Initially developed for use in wave and
selective soldering applications, SN100C®
is also available as a Lead-Free HASL
finish, solder paste, solid and cored wire,
ribbon, pre-forms and spheres. SN100C®
is quickly becoming known as the most
reliable lead-free alloy in the industry.
www.fctassembly.com
henkel
Booth #645
Hysol® UF3800™ from the elec-
tronics group of Henkel is a room
temperature, fast-flowing, low
europlacer
temperature fast curing, rework-
Booth #473
able CSP/BGA underfill designed
The IINEO-2 is a highly flexible, dual-
for use with modern handheld
cyberoptics gantry SMT assembler. The platform communication and entertain-
Booth #2071 uses the company’s proven core features— ment devices. The material flows
Flex HR is an enhanced resolution AOI turret heads, intelligent feeders, powerful fast at room temperature and
system with inspection performance for software—while introducing new technolo- cures quickly at low temperature
01005 components and larger. As one gies with linear motors and digital cameras. and does not require the substrate
othe highest-speed inspection systems in The system on display at IPC Midwest will to be preheated.
www.henkel.com
the industry, Flex HR is ideal for assembly feature one 12-spindle head and one eight-
lines producing a wide range of products spindle head.
www.europlacer.com indium corporation
including memory modules, notebooks Booth #1273
PCs, mobile phones, automotive products Indium8.9HF Solder Paste is a halogen-
and other industrial electronic assemblies. free Pb-free solder paste with unsurpassed
www.cyberoptics.com print transfer efficiency and response-to-
pause printing. The advanced rheology of
Datapaq Indium8.9HF is ideally suited for today’s
Booth #1646 advanced 0.4mm pitch and 0201 technolo-
Datapaq proudly introduces its new Easy gies.
www.halogen-free.com
Oven Setup (EOS) software for reflow
ovens. EOS is an easy-to-use software pro- inovaxe
gram that automatically calculates the best Booth #448
reflow oven settings based product and Inovaxe’s newest offering, INOVISION,
process limits that users set. Oven setup is features a modular design that contains all
reduced by more than 75% and the recipe of the inventory control feature/function-
is right the first time.
www.datapaq.com ality of INOKIT plus state-of-the-art supply
48 – Global SMT & Packaging – March 2009
www.globalsmt.net
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62