New Product Focus: Breaking old placement head paradigms
New Product Focus:
Breaking old placement
head paradigms
When evaluating the multitude of place-
ment machines available in the market
today, it’s important to understand the
placement head design and the tech-
Mixed Mode
nique employed to place components on
Full rotation
the PCB. The placement head itself has
immense impact on a machine’s overall
productivity, component range capability
and placement accuracy.
Components
Customarily, placement machines
are equipped with a type of ‘chip’ head
from 01005+
for high-speed placement of small passive
to 32 mm x 32 mm
components. To place mid-range, fine-pitch
and odd-shaped components, most ma-
chines are equipped with a fine-pitch head
Figure 1. Example of a MultiStar™ head collecting five chip components followed by three large BGAs using
that provides the necessary flexibility and
Siemens patented Mixed Mode™ placement.
accuracy not provided with the more pro-
ductive ‘chip’ head. In addition, there are
mid-range components, like SOICs, TSOPs
larger mid-range and fine pitch devices. this example, the MultiStar™ head collects
and small BGAs, to name just a few types.
It is the first head that combines the five chip components followed by three
Routinely, these component types are
Pick&Place and Collect&Place principles large BGAs using Siemens patented Mixed
placed with either the chip head, running
to Collect&Pick&Place. Mode™ placement. Significant time sav-
at reduced speed due to component size/
Looking more closely into the speci- ings are achieved because chip components
weight, or with the much slower fine-pitch
fications, the versatile MultiStar™ head are aligned/inspected using the upward
head—neither option is very desirable. The
is a high-speed revolver head capable of looking camera. After alignment, the BGAs
downside to this conventional ‘dual-head
placing up to 23,500 chips per hour using are placed first, followed in sequence by
approach’ is the inability for the line to
12 nozzles for collect/place and a digital the five chip components. The MultiStar™
balance correctly. In many cases the slower
camera on the head for true vision on-the- head can rotate both clockwise and coun-
fine-pitch head dictates the cycle time of
fly. Components from 01005 up to 27mm² ter-clockwise, which enables Mixed Mode™
the line and leads to reduced productivity
are placed at high speed using the camera placement. The MultiStar™ head’s ability
and higher manufacturing costs. Resolving
on the head for component inspection and to collect and place large and small compo-
an out-of-balance
alignment. Moreover, with an upward look- nents concurrently allows the optimization
line typically
software to equally
involves adding
distribute the
fine pitch heads or
The downside to this conventional ‘dual-head
workload across the
modules, or possibly
MultiStar™ heads
machines, which
approach’ is the inability for the line to balance
in the line. The
require additional
resulting benefit is
equipment costs,
correctly. a production line
more maintenance
that is optimally bal-
and more floor
anced and delivers
space costs.
ing camera in the machine, the same Multi- greater productivity and a lower manu-
Siemens Electronics Assembly Systems
Star™ head can also place larger compo- facturing cost. A secondary benefit, but
is addressing this manufacturing chal-
nents up to 40 mm x 50 mm. During each equally important, is the ‘all-in-one’ place-
lenge head on with its latest product
trip to the feeders, the MultiStar™ head ment capability of the MultiStar™ head.
development, the SIPLACE MultiStar™
collects a combination of up to 12 compo- Although it’s possible to quickly change
CPP placement head. The patented
nents, large and small, from tapes, trays or heads on the SIPLACE X-Series platform,
MultiStar™ head provides the ideal
tubes, then inspects the components using there is seldom the need to change heads
combination of high-speed chip place-
the camera type that suites the component to adapt to a changing product mix. This
ment without sacrificing output for the
size. Figure 1 illustrates this capability. In eliminates some of the unfavorable
40 – Global SMT & Packaging – March 2009
www.globalsmt.net
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