Global SMT & Packaging – China
China is the world’s factory, producing over 44% of the world market and 82% of the
Asian market in electronics goods, estimated to be worth $66.6 billion (2007)
[1]
. The
country is vast, with manufacturing split regionally between Beijing in the north,
Shanghai in the mid-east and Shenzhen in the south.
The Guangdong and Jiangsu provinces on the banks of the Pearl River Delta are
the leading areas of electronics manufacturing in China. These areas specialize in
automotive, consumer and industrial manufacturing, feeding the growing Chinese
consumer market (over 1.3 billion). Other
major manufacturing areas are based around
Shanghai and Suzhou.
The EMS market is diverse and split into
distinct communities, such as Japanese CEMs, Taiwanese CEM’s and other
multinationals. The market is further segmented by distributors with
focused relationships, e.g. military, medical, industrial automation and in
many cases these relationships are also regional. Penetrating this market
needs a diverse approach.
Global SMT & Packaging - China has been well established for over 5 years
with an experienced team who can guide you and offer sound advice and a range of print, electronic and video
promotions to penetrate the world’s biggest electronics manufacturing market.
Issue Technology Features Special Newletters Special Feature Exhibition/Conference Articles News-in Ad Publica-
Additional Distribution Materials tion Date
Jan/Feb Global Technology Awards, InterNEPCON World InterNepcon World, Tokyo, 22-Dec 6-Jan 6-Jan 15-Jan
8.1 Dispensing, Inspection, (Japanese) January 20 Japan January 28-30
Lead-free solder, Rework
Mar/Apr Adhesives, Cleaning, Pick Productronica Nepcon China Electronica & Productro- 23-Feb 28-Feb 5-Mar 12-Mar
8.2 & place, Printing, Thermal China(Chinese,Shanghai), show issue nica China, Semicon CPCA
Profiling Mar 12 China, Shanghai
Nepcon March 17-19
China(Chinese,Shanghai),
April 16 NEPCON China 2009,
Shanghai,
April 21-24
May/June Component Placement, PROTEC PROTEC, Tokyo, Japan 21-Apr 29-Apr 6-May 15-May
8.3 Device Programming, Preview(Japanese) June 3-5
Feeders, Wafer Bumping, May 22
Conformal Coatings
July/Aug Adhesives, Lead-free, Test Nepcon South China Nepcon South Nepcon South China 30-Jun 11-Jul 18-Jul 25-Jul
8.4 X-ray inspection (Chinese) Augest 20 China show Shenzhen, August 31-
issue September 2
Sep/Oct BGAs, MCMs, Cleaning, Globaltronics Singapore 2-Sep 8-Sep 15-Sep 22-Sep
8.5 Reflow/Profiling, Wave TBA
Soldering Bohai Electronics Week
TBA
Nov Dec Advanced Substrates, 23-Oct 2-Nov 9-Nov 16-Nov
8.6 Handling, Software, Un-
derfills, Hand Soldering
[1] Source: iSuppli
China Editor - Features China Editor - News
Lu Shuzhen Christine Zhang
Tel: +86 (351)652 3813 Tel: +86 (133) 1102 1565
Email: lshuzhen@globalsmt.net Email: czhang@globalsmt.net
8 - www.globalsmt.net
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