Promotion Packages
Video Value Package Trade Show Daily Packages
(Productronica, Germany)
The package comprises:
• Video commercial run on pre-show news
Maximize your exposure at any of these major events with our
broadcast and on show monitors.
Gold, Silver or Bronze Packages. Each Package comprises the
following:
• Video Interview or Product Spotlight
during Day One.
Gold: (Full page advert in October, November and December
• Literature Pockets to display your
Issues and Show Daily (3 days), plus Skyscraper in Show Preview
information under the monitors* Newsletter, plus video interview or Product Spotlight.
• Tile advertisement on Show Central area
for one year.
Silver: (Half page advert in October, November and December
• Copy of clips for your website or TV monitors.
Issues and Show Daily (3 days), plus Skyscraper in Show Preview
Newsletter, plus video interview or Product Spotlight.
Video Value Packages are available at the following trade shows:
Bronze: (Bronze page advert in October, November and De-
Internepcon Japan, APEX, SMT/PCB Korea, Nepcon India,
cember Issues and Show Daily (3 days), plus Skyscraper in Show
Electronica/Productronica China, Nepcon China, Shanghai;
Preview Newsletter, plus video interview or Product Spotlight.
SMT/Hybrid/Packaging, Germany; ElectronicAmericas,
Brazil; Semicon West, USA; SMTAI, USA; IPC Midwest, USA; Of course, you can opt to go a la carte and mix and match the
Productronica, Germany.
promotions to match your requirements and your budget.
Issue Technology Special Special Exhibition/Conference Additional Article News Ad Materials Publication
Featur
Featur
es List
e Newsletter Features Distribution Deadline Deadline Deadline Date
Jan. Bump Inspection Global InterNEPCON World, Tokyo, Japan Nov. 20 Nov. 27 Dec. 4 Dec. 14
9.1 Die Bonders Technology January, 28 - 30
Flip Chip Awards Issue Pan Pacific Conference, Big Island, Hawaii
Lead free solders January, 10 - 12
MEMs
Cleaning
Feb. Stencil Printing, Componex India Componex/Nepcon India Dec. 28 Jan. 2 Jan. 9 Jan. 22
9.2 Selective Soldering, (English) February, 24 - 26
Component Design, February 10
Boundary Scan,
Wafer Bumping
Pick & Place
Mar. Dispensing, Semicon China Medical ElectronicChina/Productronica, Semicon, Jan. 22 Jan. 29 Feb. 5 Feb. 13
9.3 Chip Scale (Chinese) Electronics CPCA Shanghai, China
Packaging, Stacked March 4 March , 17 – 19
Die Packaging,
0201 Placement, APEX Preview SMART Systems, Brussels,
Board (English) Belgium
Contamination, March 18 March 10 - 11
ESD Control
Nepcon Korea
(Korean)
March 25
Apr. Process Nepcon APEX APEX 2008, Las Vegas, NV, USA Feb. 20 Feb. 27 Mar. 5 Mar. 18
9.4 Management Shanghai Show Issue March 31
st
- April, 2
Software, (Chinese)
Rework Equipment, April 7 Nepcon Korea, Seoul, Korea
Advanced April, 8 - 10
Substrates, SMT
3D Circuits, Nuremberg
Sensors (English) Nepcon Shanghai 2008
Die Placement April 18 Shanghai, China
April, 21 – 24
Electrontech Expo/ Expo Electronica,
Moscow, Russia
April, 15-18
www.globalsmt.net - 5
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