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Test and Assembly


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SemiconWest Product Preview


VOLUME 31 - NUMBER 6


Product Preview: ATX and


MD&M East THE GLOBAL HI-TECH ELECTRONICS PUBLICATION June, 2016


Saki: True 3D Makes the Difference I


By Quintin Armstrong and Satoshi Otake, Saki Corporation


n today’s litigious world, 3D automated X-ray inspec- tion has become a necessity, especially in the automo- tive, medical, and aerospace industries. When boards


are exposed to high heat, voids can result in explosions and electrical failures. Head-in-pillow and non-wetting solder joints are especially difficult to detect. The problem with X-ray inspection has been that manufacturers have had to design their inspection systems to remove the im-


UV-curable conformal coat- ing material from Dymax in our Product Preview start- ing on. . .


Page 62 Cutting


Processing Time at Spinnaker


New Hampshire-based EMS provider Spinnaker pur- chased an ERSA Versaflow 3/45 selective soldering sys- tem and expects to cut its pro- cessing time by up to 75 per- cent; Sunstone Circuits cre- ates high-performance PCBs in small form factors to help improve motorcycle gas mile - age.


Page 20 This Month's Focus:


Components and Distribution


Process optimization using plasma surface treatment; press-fit pins and receptacles for daughterboard to mother- board, component, module, or cable to PCB; what JTAG rules and test methodology have brought to the manufac- turing industry.


Page 52


ages from the underside of the board, so instead of being a true 3D system, they are actually more like 2.5D. Their systems take a maximum of 5 slices through the board, often missing a defect. Saki’s 3D AXI system is a true 3D system, using high


resolution planar computed tomography to completely sep- arate the top and bottom of the board. The system takes up to 200 slices through the board, solder joints, and compo- nents and inspects and measures them, with on-the-fly re- construction and volume measurements for every solder joint, creating 3D data for the entire sample. Defects are identified and classified — including 100 percent of head-in-pillow defects, voids, and dry joints. This results in best-in-class Cpk and gage repeatability and repro- ducibility.


Third Generation In April, the Saki Corporation


marked its 22nd anniversary and the Continued on page 8


20-Layer PCB Made from One CAD File


At IPC APEX booth, (left to right): Quintin Armstrong,


General Manager North America Sales and Service, Saki America, Sakie (Jodie) Akiyama, CEO, Saki Corp., Satoshi Otake,


General Manager Saki America, and Norihiro Koike, COO, Saki Corp.


Global Warming Danger to Coastal Cities


Albuquerque, NM — In Norfolk, Vir- ginia, an East Coast city that’s home to the world’s largest naval station and important seaports, catastrophic flooding could damage more than homes and roads. A new study from Sandia National Laboratories as- sesses how much the city, its region and the nation would suffer in dam- ages to national assets and lost eco-


nomic activity if it does nothing to address rising sea levels. In partnership with the City of


Norfolk’s Resilience Office and 100 Resilient Cities (100RC), pioneered by The Rockefeller Foundation, San- dia analyzed the risk to important assets, quantified their value and helped Norfolk prioritize the most ef- fective ways to stay resilient in a natural or manmade disaster. Sandia created an Urban Re-


silience Analysis Process to help re- frame the conversation in Norfolk re- garding flooding and demonstrate how the long-term benefits of mitiga- tion outweigh the short-term costs associated with it. The city and re- gion are now taking new approaches to handle the resilience challenges


Continued on page 6


Bannockburn, IL — The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board As- sembly Products Manufacturing De- scription Data and Transfer Method- ology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufac- turing for fabrication, assembly and test.


During the design forum at IPC


APEX 2016, this newest release was applied to a real-world scenario, when founding IPC-2581 Consortium member company, Fujitsu Network Communications, Inc., unveiled a 20- layer complex board manufactured only using an IPC-2581B design file. “IPC-2581B uses an intelligent


XML schema format that accelerates printed circuit board fabrication, as- sembly and testing, and enables de- sign data to be transferred between engineering and manufacturing with - out the need for human interpreta- tion,” says Tsuyoshi Ueshima, senior vice president of development at Fu- jitsu Network Communications. “This eliminates redundant labor and re- duces the opportunity for error, re- sulting in the high quality products that customers expect.” Web: www.ipc-2581.com r


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