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An inert atmosphere cabinet oven from Grieve stars in this month's EMS products section, starting on . . .

Page 22 End-to-End

Tracibility at Saline

EMS provider Saline Lectron- ics recently implemented Track, Trace, and Control (TTC) system from Cogiscan throughout its expanded man- ufacturing facility to provide customers with detailed end- to-end traceability of product flow.

Page 18 This Month's Focus:

Production and Packaging

Find out how to manage board warpage, making critical deci- sions about onshoring and reshoring, designs for 3D packaging, finding risky com- ponents, and using a modular AOI system.

Page 50

Wichita, KS — Something new, won- derful and breathtaking has hap- pened in the U.S. aerospace industry. After years of budget fights, many billions of tax dollars spent, and mostly wasted on new military fight- er planes that still are far from ready to use, and may never actually see service, two gutsy American compa- nies — Textron, Inc. (NYSE: TXT)

How COTS-Built Fighter May Win the World

and Airland Enterprises LLC formed a joint venture called Textron Air- Land LLC to design and build the next generation of lightweight fight- er aircraft. They did it with zero gov- ernment funding, used a lot of COTS (commercial off-the-shelf) parts and created a sleek composite shell, tak- ing all of 23 months from those first sketches that were probably drawn

on a restaurant napkin to a working, flying prototype. And they did it for an investment of about $100 million to go from concept to finished, weapons-carrying, flying prototype. The new joint venture rolled out

the first “Scorpion” fighter plane, test- ed it with and without weapons, and then flew it across the Atlantic to ap- pear at air shows in England and France. The F-35 did not make an ap- pearance; the entire fleet had been grounded because of fires breaking out on the aircraft. Did anyone happen to check the Lithium-ion batteries? The Scorpion has no “F” desig-

nation since it was not ordered by the U.S. government, but is strictly the result of a corporate venture. It is moderately fast, with a maximum speed of 517 mph, and very nimble, but can slow down to less than 100

Continued on page 8

Two pilots can share the flying duties in the new Scorpion strike fighter.

ANSI Standardization Roadmap to Save Energy

New York, NY — With the release of the Standardization Roadmap: En- ergy Efficiency in the Built Environ- ment, U.S. industry, government, standards developing organizations (SDOs) and other energy efficiency stakeholders now have a national framework for action and coordina- tion on future energy efficiency stan- dardization. Developed by the American Na-

tional Standards Institute (ANSI) Energy Efficiency Standardization Coordination Collaborative (EESCC) — a cross-sector group chaired by

representatives of the U.S. Depart- ment of Energy (DOE) and Schnei- der Electric — the roadmap charts 125 recommendations to advance en- ergy efficiency within the built envi- ronment. According to the DOE, our na-

tion’s buildings account for more than 70 percent of total U.S. electric- ity use and 40 percent of the nation’s total energy bill, at a cost of $400 bil- lion dollars per year. With 20 percent or more of this energy wasted, com- parable reductions in energy have the potential to save an estimated $80 billion annually. Standards, codes, and conformi-

ty assessment programs offer signifi- cant opportunities for energy and cost savings and improved energy ef- ficiency capabilities for the nation’s buildings. The roadmap identifies many such opportunities, detailing recommendations and timelines for action across five interrelated areas of focus.

Continued on page 6

SEMI Forecast: Back-to-Back Years of Double-Digit Growth

San Francisco, CA — SEMI projects back-to-back years of double-digit growth in worldwide semiconductor equipment sales, according to the mid-year edition of the SEMI Capital Equip ment Forecast, released at the annual SEMICON West exposition. The SEMI outlook calls for the total semiconductor equipment market to grow 20.8 percent in 2014 to reach $38.4 billion and to expand another 10.8 percent in 2015 to exceed $42.6 billion. Following two years of spending

declines, key drivers for equipment spending are investments by foundry and logic fabs for sub 20nm technolo- gy, NAND flash makers for leading edge technology (including 3D NAND) and capacity, DRAM technology up- grades for mobile applications, and ex- pansion of advanced packaging capac- ity for flip chip, wafer bumping, and wafer-level packaging. All regions of the world are projected to see equip- ment spending increases in 2015. Front-end wafer processing equip - ment is forecast to grow 11.9 percent in 2015 to $34.8 billion, up from $31.1 billion in 2014. Test equipment

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