CONNECTING THE SILICON SEMICONDUCTOR COMMUNITY Volume 34 Issue 3


Editor-in-Chief David Ridsdale


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Consultant Editor Richard Stevenson PhD


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News Editor Dr.Su Westwater


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Director of Solar & Semiconductor Publishing Jackie Cannon


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Senior Sales Executive Robin Halder


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Sales Manager Shehzad Munshi +44 (0)1923 690215


USA Representatives Brun Media Tom Brun


Tel: 724 539-2404 Janice Jenkins


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Director of Logistics Sharon Cowley


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Design & Production Manager Mitchell Gaynor


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Circulation Director Jan Smoothy


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Subscriptions Manager Debbie Higham


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Chief Operating Officer Stephen Whitehurst stephen.whitehurst@angelbc.com +44 (0)2476 718970


Directors


Bill Dunlop Uprichard – CEO Stephen Whitehurst – COO Jan Smoothy – CFO Jackie Cannon, Scott Adams, Sharon Cowley, Sukhi Bhadal


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People should not underestimate the dynamic change that ASMLs dogged insistence that they would not be stumping up the research costs for 450mm and EUV without financial investments from the three major industry manufacturers. When the 300mm transition took place a number of OEM companies attempted to involve the manufacturers in covering the growing research costs on tools that may never see an ROI. One OEM even went as far as providing total solutions for the move to 300mm and the upcoming move towards 65nm but this was dismissed out of hand by the bigger players at the time. In fact much of the dialogue around 300mm was about the unfairness of how costs were distributed along the value chain.


At the time many companies stated they would not allow the manufacturers to dictate the rules at the next size transition. ASML was definitely not one of the companies back then and was not even the number one lithography company. The fact they are now able to dictate terms to the manufacturers shows how much of enabler lithography has become. Not just in terms of the technology but the sheer cost of new tools means they are taking an ever increasing part of the IC pie. A large enough section to be able to give manufacturers a taste of their own medicine.


This will not be the end of the changing dynamics and ASML’s boldness only serves a warning that more of this is to come. Maintaining Moore’s Law is no longer the right of the manufacturer to expect the required tools. The value chain is more integrated with fewer players so sometimes the choices are limited for manufacturers providing one lithography company the technical expertise required to force a cash up front scenario that would have been unthinkable only a few years ago.


As 450mm takes hold companies will need to ensure potential customers are truly aware of their skill and expertise as there will be richer and louder competitors jumping up and down trying to get the same attention.


David Ridsdale Editor


Issue III 2012 www.siliconsemiconductor.net 3 debbie.higham@angelbc.com jan.smoothy@angelbc.com mitch.gaynor@angelbc.com sharon.cowley@angelbc.com shehzad.munshi@angelbc.com E: tbrun@brunmedia.com E: jjenkins@brunmedia.com


As expected the major manufacturers have instigated the move to 450mm and once again have moved in such a way that OEM and materials manufacturers have no choice but to join in or fear losing out on the next increase in wafer size. At least this is the case for most of the industry except one company whose bold moves have rewritten the way OEMs deal with manufacturers. ASML was one of the first companies I did a profile on when I joined this industry and a great deal has changed to enable the company to not only become the largest OEM supplier on the planet but to have enough clout to encourage manufacturers to


invest billions of dollars in ASML to ensure that 450mm targets are made possible. robin.halder@angelbc.com The 450mm juggernaut jackie.cannon@angelbc.com david.ridsdale@angelbc.com


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