imaging and machine vision europe october/november 2011
www.imveurope.com
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image processing libraries
use a configuration tool. An OEM, on the other hand, typically needs more flexibility and is generally more experienced in programming.
Another dimension Colour and 3D imaging are two areas Boriero is seeing a lot of interest in. He also adds code reading – barcodes or data matrix codes – to that list because of underlying trends for traceability in manufacturing. Dr Eckstein also pinpoints 3D imaging as
a major growth area: ‘There is a wide range of 3D sensors available and 3D imaging provides new inspection possibilities. Consider the developments in 2D image processing over the last 30 years; a huge range of algorithms have been developed in this space, such as blob analysis, texture analysis, and template matching, to name a few. The same level of development has to take place for 3D.’ From the customer’s perspective, the
software tools available for 3D image processing are similar to those for 2D – object alignment, for instance, or object identification and classification in the image works along similar principles whether in 2D or 3D. However, the
algorithms for these processes are much more complex in 3D than in 2D because of the extra dimension. Dr Eckstein cites a 3D pattern matching algorithm as being comprised of around 300,000 lines of code. ‘Even ignoring testing and specification, this requires lots of manpower to develop,’ he says. ‘The increased sophistication in 3D algorithms is so that the execution time remains similar for 3D tools
‘Colour and 3D imaging might be growth areas, but they are still marginal in terms of volume’
compared to their 2D counterparts. Besides this, there is a lot of new mathematics required, because the internal algorithms differ from those in 2D – not everything that works in 2D can be converted to 3D.’ Boriero states: ‘Users can get overly excited
about new tools in 3D imaging, for example, sometimes to a point where they lose sight of solving the application, which can often be
resolved using traditional 2D tools. But there’s still momentum for 3D and colour imaging.’ Colour and 3D imaging might be growth
areas, but Lina states that they are still marginal in terms of volume. According to Marc Damhaut, CEO of machine vision company Euresys, this is similar to his experience: ‘Surprisingly, the most popular, i.e. most used, features of Open eVision are still the first libraries that we have developed: sub- pixel measurement, blob analysis and pattern matching. They are appropriate for most of today’s applications.’ Open eVision is Euresys’ imaging library suitable for most applications, although it has had a lot of success, according to Damhaut, in semiconductor inspection, as well as LED and solar cell inspection. ‘Most of the applications can be solved with
simple, classical tools,’ Lina adds. ‘The issue with selecting an imaging library is not in terms of high-end algorithms for most people; it’s in terms of compatibility, long-term support, ease of use, and ease of deployment,’ he says, adding that there are still incremental developments taking place on classical algorithms to enhance and optimise them.
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