Special Outpacing VME:
OpenVPX fast-tracks technologies to the front lines By Brian Roberts
VPX is replacing VME. OpenVPX is that part of VPX that facilitates multivendor COTS system-level interoperability including modules, backplanes, and development chassis. Since embedded defense systems must often be developed and deployed rapidly, it is very important that potential conflicts are eliminated as quickly as possible during the design phase.
VME has long been used in mission- critical embedded systems. Ho wever, its VPX (VITA 46) progeny surpasses VME in bandwidth and power. But VPX designers soon found that VPX yielded its share of system-le vel interoperabil- ity issues: Multiple vendors’ boards and components were often incompatible within the lar ger system design, pre - senting a major obstacle to VPX system development. The answer: OpenVPX (VITA 65), a leading system architecture standard in field-deployed, mission-crit- ical embedded systems.
OpenVPX’s goal is to pro vide a frame- work for system-le vel interoperability for COTS-based VPX Line Replace - able Units (LRUs). LRUs’ main plus is that they are Two-Level Maintenance (2LM) compatible. The ultimate goal of two-level maintenance in all comple x defense systems, including OpenVPX, is to enable a field technician without spe- cial maintenance tools to quickly iden - tify a faulty board and swap it in a harsh and hostile environment – and therefore quickly return the system to operation.
The need for speed is also relevant to the OpenVPX design phase. Since embedded defense systems must often be developed and deployed rapidly, it is very important that potential conflicts between the v ari- ous profiles are eliminated as quickly as possible. SWaP and thermal management, along with other requirements, must be resolved faster so that advanced capabili- ties can be swiftly engaged.
Accordingly, OpenVPX’s proven field- deployed readiness and a dvanced sys- tems design flexibility hasten the delivery of next-generation customizable COTS solutions to the front lines, today and tomorrow – and at a rapid pace. The fol- lowing discussion e xamines VME and OpenVPX pertaining to:
VME and Critical Systems / Spring 2011 23
1. SWaP and thermal management 2. Technical considerations for connec- tors and backplanes
SWaP and thermal management Current and future embedded processors are pushing and exceeding the once prime- time VME64x 35 watts/slot at +12 V limit. Processor core densities and the number of cores on a chip are increasing the input power required by processor boards. Even as the power efficiency of processor technology increases, demand
for increased operation rates and com - plexity will probably take up the slack in order to more rapidly decrease OpenVPX- based technologies to the w arfighter. A look at SWaP and thermal management considerations will lend insight.
Currently, OpenVPX uses 3U (100 mm x 160 mm) and 6U (233 mm x 160 mm) form factors. Since more applications are moving to the lighter , smaller 3U form factor, heat management has become more important than e ver, which, of
VPX/OpenVPX on the front lines
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