Microcontrollers and SoCs Microcontrollers
Silicon |
G-Series processors, ranging from the AMD T44R 1.2 GHz single-core processor with 9 W TDP, to the AMD T56N 1.6GHz dual-core processor with 18 W TDP. The conga-BAF has two DIMM slots for up to 8 GB of DDR3 RAM and allows dual independent displays with interfaces for VGA, LVDS, DisplayPort, and DVI/ HDMI. Additional I/O options include six PCI Express x1 lanes, eight USB 2.0 ports, four SATA ports, one EIDE, and a 1 Gigabit Ethernet interface. Conforming to the COM Express basic form factor (4.9 x 3.7 inches), the module operates over the 32 ºF to 140 ºF temperature range. It supports multiple operating sys- tems including Windows 7, Windows XP, Windows Embedded Standard, Linux, and QNX.
[Figure 2 | The conga-BAF COM Express module from congatec features the AMD Embedded G-Series processors.]
These new Intel and AMD multicore processors just offered to designers are closely tuned to the evolving expecta- tions of the latest embedded projects. In addition to the promise of long term avail- ability, the processors feature increased
performance and lower power while integrating the graphics processor to simplify and enhance the user interface. Both of the new multicore families are based on the x86 architecture, allowing embedded system designers to lower development costs and schedules by integrating widely available personal computer software. Multiple applications such as digital signage, set-top boxes, infor- mation kiosks, point-of-sale machines, and gaming platforms can take advantage of some of the same low-cost, off-the-shelf hardware components and software tools used for desktop development. Regardless of the application, designers should inves- tigate the latest multicore processors on any new development project, and as a result, customers can expect to see a new era of smaller, faster, and lower-priced embedded products.
Warren Webb’s background includes more than 30 years as an engineer and entrepreneur developing high- tech products for the aerospace and
healthcare industries. Most recently, he has been writing articles on hardware design, software development, and emerging technologies for international trade magazines. Warren holds an MBA from Pepperdine University, an MS in Electrical Engineering from San Diego State, and a High Honors BSEE from the University of Tennessee.
OpenSystems Media
wwebb@opensystemsmedia.com www.opensystemsmedia.com
ECD in 2D: See an Intel Field Application Engineer discuss the Intel 2nd Generation Core Processor. Use your smartphone, scan this code, watch a video:
http://bit.ly/hjCYTV
10 | April 2011 Embedded Computing Design
www.embedded-computing.com
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