Vector Extensions (AVX), which is back- ward compatible with previous x86 ISA extensions and is optimized for vector and scalar data sets such as those found in embedded signal processing applications.


processors that support extended life cycle embedded applications. These Core i3/i5/i7 processors combine either two or four CPU cores, an integrated graphics processor, Last Level Cache (LLC), and a system agent/memory controller that all communicate using a scalable on-die ring interconnect system. The ring technology allows Intel to adjust the number of cores and create varia- tions that optimize cost, performance, and power requirements for a wide range of embedded applications. Designers can select a version that not only covers current requirements, but also leaves room for future performance enhancements.


Performance boost for intense workloads


The Intel 2nd Generation Core processors also include a number of new or expanded technologies to enhance embedded designs. For example, all of the CPU cores (including the graphics core) feature Intel Turbo Boost Technology, allowing clock frequencies to scale up temporar- ily. The processors also include a new 256-bit instruction set called Advanced


www.embedded-computing.com [Figure 1 | The IM-QM67 motherboard from MSI brings Intel Core i7 and Core i5 processors to the industrial market.]


Targeting the Industrial Platform Computing (IPC) market segment of the embedded industry, MSI recently upgraded its IM-QM67 motherboard to accept the 2nd Generation Intel Core processor family (see Figure 1). The new IM-QM67, based on the Intel Core i7 and Core i5 processors and the Intel QM67 Express chipset, includes multiple dis- play outputs with LVDS, VGA, DVI, HDMI, and embedded DisplayPort inter- faces. The board also features Direct-X 10 Shader Model 4.0 and full hardware acceleration, delivering 3D graphics and support for up to 1080P high-definition video. Intel Active Management Tech- nology provides the user with certifi- cate-based activation, reconfiguration, and possibly, deactivation of remote embedded systems, regardless of the cur- rent operational status. This Mini-ITX form factor board features dual SO-DIMM slots for up to 8 GB of RAM, one CompactFlash slot, and five SATA ports for data storage along with one PCI slot for I/O expansion.


available with single- or dual-processor cores, at 9 W or 18 W Thermal Design Power (TDP), and at two levels of graphics and video performance. The graphics unit includes multiple con- figurable parallel processing units that can also be used for compute-intensive, non-graphics processing tasks such as encryption/decryption and network packet processing.


Each APU drives one or two high- resolution displays with built-in hardware decode support for H.264, VC-1, MPEG2, WMV, DivX, and Adobe Flash. The APU is also compatible with both OpenCL and DirectCompute APIs, allowing developers to create multi-thread, parallel software analysis functions for real-time pattern recognition in applications such as video surveillance, radar data analysis, and medical imaging. Designers can choose from multiple I/O controller hub options, available for the APU depending on the desired feature set. For example, the A50M chipset supplies 6 Gbps SATA, Generation 2 PCI Express, and HD Audio. For high end applications, the A55E I/O controller hub includes Gigabit Ethernet MAC, RAID support with FIS-based switching, and a PCI Local bus.


Multicore module fits graphics projects


Figure 1 | The IM-QM67 motherboard from MSI brings Intel Core i7 and Core i5 processors to the industrial market.


AMD also announced a new family of multicore platforms aimed at the embed- ded market earlier this year. The AMD Fusion Embedded G-Series processor is based on the “Bobcat” architecture. It combines low-power x86 processor cores and a DirectX 11-capable graphics processing unit into a single Accelerated Processing Unit (APU) for embedded applications. APU configurations are


Shortly after the introduction of the AMD Fusion Embedded G-Series processor, several manufacturers announced com- patible, off-the-shelf modules based on popular embedded standards. For example, congatec revealed a new COM Express module, conga-BAF, to target low-power, graphics-based embedded projects (see Figure 2). The module was designed around five of the AMD Embedded


Figure 2 | The conga-BAF COM Express module from congatec features the AMD Embedded G-Series processors.


Embedded Computing Design April 2011 | 9


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