LEDs ♦ industry news Get ready for automation
Though small wafers, cheap labor and long batch processes have limited the need for automation so far, the LED industry is transitioning to more and more automation as it goes to larger wafers and higher volumes. Robotic wafer handling, automated glove boxes, interbay automation, mini-environments and standardized carriers such as SMIFS are all technologies that will become pervasive in LED fabs of the future, argues Clint Haris, senior VP of the Systems Solution group at Brooks Automation. He points out that LED makers are starting to look towards automation to improve yields and traceability. “The industry is rapidly evolving from manual operation to fully automated factories,” he says, noting that the LED industry has seen change in the last five years that took 40 years in the semiconductor industry. “Things are moving so quickly, standards need to focus on the leading edge, 6-inch wafers, 6-inch cassettes, and some sort of wafer or carrier-level identification for traceability as the basics to enable automation.”
Packaged LED market expected CAGR of 28.2% between 2009 & 2015
Yole Développement and EPIC announce the publication on 15 November 2010 of their new market & technological studies dedicated to LED market and manufacturing technologies:
Status of the LED industry “SLI 2010”, 2008 – 2020 analysis LED Manufacturing Technologies “LED ManTech 2010”
This comprehensive survey describes the main market metrics and manufacturing technologies implementing broad adoption of Solid State Lighting.
The packaged LED market is experiencing tremendous growth with an expected CAGR of 28.2% between 2009 and 2015. In their base scenario, revenues will reach $8.9b in 2010 and grow to $25.7b in 2015 and close to $30b in 2020.
In terms of volume, LED die surface will increase from 6.3b mm2 to 51b mm2 in 2015, a 41.6%
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www.compoundsemiconductor.net November/December 2010
CAGR. This will prompt substrate volumes to growth from 12.7M TIE (Two Inch Equivalent) in 2009 to 84.4M TIE in 2015, a 37.1% CAGR (smaller than the die surface increase due to significant manufacturing yield improvements). The equipment market will experiment a dramatic growth cycle with demand driving the installation of close to 1400 reactors in the 2010-2012 period.
“Anticipation of future demand and generous subsidies in China will trigger the installation of another 700-1000 reactors in the same period, leading to a short period of oversupply starting in late 2011. However, this oversupply will mostly affect the low end of the market.”, explains Tom Pearsall, EPIC.
Growth in general lighting applications will be enabled by significant technology and manufacturing efficiency improvements that will help to lower the cost per lumen of packaged LED to be reduced 10 fold between 2010 and 2020: Economies of scale, LED efficiency improvement, including at high power (droop effect), Improved phosphors, Improved packaging technologies, Significant improvements in LED epitaxy cost of ownership through yield and throughput. However, additional breakthroughs’ are needed; Haitz’s Law is not enough.
Eulitha Writes a New Story with PHABLE Technology for LED & Solar Markets
The Swiss Firms’ patented mask based UV lithography enables the formation of periodic nanostructures over large areas for applications such as LEDs and solar cells. It avoids contact between the mask and the wafer and does not require consumable soft-stamps.
Eulitha, a Swiss based nanolithography company, has developed a proprietary photolithography technology for low-cost and high-throughput fabrication of photonic nanostructures.
This solves a major ongoing problem faced in the fabrication of high-resolution photonic structures since standard photolithography equipment either lacks the required resolution or its cost is
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