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enough to continually changing noise/signal ratios. Furthermore, relying on scattered light information limits the ability to accurately classify defects in today’s production environments.”


EyeEdge is designed to accommodate an optional fourth optical sensor to analyze a programmable crown area on a wafer’s frontside edge. While maintaining the system’s processing accuracy and high throughput, this additional sensor enables EyeEdge to measure layer-overlapping control, providing a unique high-speed, low-cost solution to control insulating, barrier and seed layers, copper electroplating and chemical mechanical planarization (CMP), photoresist edge-bead removal (EBR) and edge-cleaning effectiveness.


EyeEdge is a stand-alone system, but can be added as a module onto the AltaSight platform to create a holistic system that can inspect a wafer’s frontside, backside and edge simultaneously using a combination of reflectivity, topographical, dark- field and DeepSight technologies.


“This is another major milestone in our product development roadmap,” said Delcarri. “We have fuelled our innovation with continued customer interaction and partnership and a large breadth of technologies in our IP portfolio. We have quickly converted them into productive products and brought them to the market. This is our DNA, and the demand is out there. As everyone is striving for improved performance, our engineering team, sales and support services are being expanded worldwide to solve our customers’ challenges around the world.”


Incorporated in 2004, Altatech Semiconductor manufactures wafer inspection and analysis, liquid- vaporization CVD, and nanoprinting equipment at its headquarters facility near Grenoble, France’s epicenter of microelectronics production. Led by a management team with more than 30 years of experience in the semiconductor equipment industry, the company is focused on helping customers to achieve the fastest design-to-market cycle times for products serving the emerging semiconductor, MEMS and nanotechnology markets.


Nanometrics Announces Planned Retirement of CFO


James P. Moniz, who has provided substantial contributions in bringing Nanometrics to new levels of financial performance and operational excellence, intends to retire on 1 April 2011.


Nanometrics Incorporated a leading provider of advanced process control metrology systems, has announced that James P. Moniz, chief financial officer, has informed the company of his intention to retire on April 1, 2011.


The company has retained an executive search firm to identify an appropriate successor and Moniz will remain in his role to ensure a seamless transition of the CFO role next year.


“I want to thank Jim for his substantial contributions in bringing Nanometrics to new levels of financial performance and operational excellence,” commented Timothy J. Stultz, president and CEO. “I understand and fully support his desire to retire and spend more time with his family in the years to come. In the meantime, Jim will continue to be an integral part of the Nanometrics team, providing strong financial leadership and a smooth transition to our next CFO. Jim has built a strong team and is leaving behind a solid foundation to support our company’s continued growth.”


Nanometrics is a leading provider of advanced, high-performance process control metrology systems used primarily in the fabrication of semiconductors, high-brightness LEDs, data storage devices and solar photovoltaics. Nanometrics’ automated and integrated metrology systems measure critical dimensions, device structures, overlay registration, topography and various thin film properties, including film thickness as well as optical, electrical and material properties.


The company’s process control solutions are deployed throughout the fabrication process, from front-end-of-line substrate manufacturing, to high-volume production of semiconductors and other devices, to advanced wafer-scale packaging applications. Nanometrics’ systems enable device manufacturers to improve yields, increase productivity and lower their manufacturing costs.


218 www.compoundsemiconductor.net November/December 2010


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