IndustryNews
QDI 2010 Forensic
™
Microspectrophotometer Helios 1200 Full Wafer DualBeam
™
System
Trace evidence is one of the most common FEI Company announced the newest
types of evidence recovered from a crime member of the Helios NanoLab™ Family—the
scene. It includes textile fi bers, hair, paint chips, Helios 1200 Full Wafer DualBeam™ system.
and more. Due to its size, trace evidence is Th e ability of the Helios 1200 to analyze full
commonly only visible by microscope, making wafers up to 300 mm improves the effi ciency
a thorough analysis of it quite challenging. of semiconductor and data storage failure
CRAIC Technologies, the leading innovator analysis and manufacturing support labs that
of UV-visible-NIR microanalysis solutions for need to deliver accurate data quickly to the
forensic laboratories, announces the QDI 2010 production fl oor. Th e Helios 1200 combines (SEM) image resolution
Forensic™ microspectrophotometer. Th is system and extremely fast switching between imaging and ion beam milling
is confi gured to rapidly and non-destructively to deliver rapid, reliable, effi cient cross-sectional analysis of structures
analyze many types of trace evidence. and defects. It can accommodate full wafers up to 300 mm.
CRAIC Technologies
FEI Company
www.microspectra.com
www.fei.com
Quemesa TEM Camera Axio CSM 700 Confocal Microscope
High sensitivity and contrast at optimal Th e accurate measurement of large sample
resolution are the ultimate goals for a TEM areas is now faster, simpler, and more
camera. Every single photon generated in the convenient with the introduction of the
scintillator per incident electron is needed. Axio CSM 700 confocal microscope. Th e
Th is means the scintillator has to be optimized new microscope visualizes surfaces three-
for the entire pear-shaped interaction volume dimensionally in true color at high resolution
to achieve maximum signal. Consider the to enable the precise measurement of 3D
Quemesa, the new 11-Megapixel, on-axis microstructure surface roughness. Ideally
TEM camera by Olympus Soft Imaging Solutions, where scintillator suited to materials research, quality inspection,
thickness and pixel size are perfectly matched to the dimensions of the and routine applications, the Axio CSM 700 performs topographical
entire interaction volume. measurements at a rate of more than 100 frames per second.
Olympus Soft Imaging Solutions Carl Zeiss
www.soft-imaging.net www.zeiss.com/micro
mySEM
®
Wins R&D 100 Award STACIS
®
Floor Platform System
Novelx, Inc. was just selected for a prestigious Technical Manufacturing Corp.
R&D 100 Award for one of the 100 most announces its STACIS® FP
technologically signifi cant new products in active vibration cancellation
2009. R&D Magazine recognized the Novelx fl oor platform system designed
mySEM
®
for miniaturizing and driving the cost for use with scanning electron
out of the core technology inside a scanning microscopes (SEMs). Th e STACIS®
electron microscope (SEM). Powered by the FP features sub-Hz vibration cancellation in an active hard-mount
patented Novelx Stacked Silicon Technology, the fl oor platform that fi ts most commercial SEMs. SEMs are among the
mySEM is a bench-top SEM for imaging and characterizing nanoscale most vibration sensitive tools made, and these precision instruments
objects and materials. Utilizing a compact design, the mySEM delivers typically incorporate an internal vibration isolation system. STACIS®
capabilities previously only available in high-end fi eld emission SEMs. FP is compatible with all internal SEM vibration isolation systems.
Novelx, Inc. Technical Manufacturing Corporation
www.novelx.com www.techmfg.com/products/fl oorplatforms/
Stacis_FP.html
Dip Pen Nanolithography
®
(DPN
®
) SIGMA Field Emission SEM
Recent advances in producing a Carl Zeiss launched a variable pressure (VP)
variety of new nanoscale products operation mode as an extension of its SIGMA
using NanoInk’s patented Dip fi eld emission scanning electron microscope
Pen Nanolithography® (DPN®) (FE-SEM). Featuring the Carl Zeiss GEMINI®
have been achieved with a column, proven VP technology, and a
new thermoelectric variable design with analytical accessories in mind,
temperature stage module. Th e the SIGMA VP provides a comprehensive
suite of materials that can be analytical solution for a constantly growing
controllably deposited with DPN amount of applications. Th e chamber includes
will grow with this new range of temperatures. Th is new approach the provision for all WDS variants, as well as a geometry suitable for
enables the deposition of a wide variety of new molecules. coplanar EDS and EBSD analysis.
NanoInk Carl Zeiss
www.nanoink.net www.zeiss.com/nts
2009 September •
www.microscopy-today.com 59
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76